2.4 GHZ Ieee 802.15.4 / Zigbee-Ready RF Transceiver: Applications
2.4 GHZ Ieee 802.15.4 / Zigbee-Ready RF Transceiver: Applications
CC2420
Applications
Product Description
The CC2420 is a true single-chip 2.4 GHz features reduce the load on the host
IEEE 802.15.4 compliant RF transceiver controller and allow CC2420 to interface
designed for low power and low voltage low-cost microcontrollers.
wireless applications. CC2420 includes a
digital direct sequence spread spectrum The configuration interface and transmit /
baseband modem providing a spreading receive FIFOs of CC2420 are accessed via
gain of 9 dB and an effective data rate of an SPI interface. In a typical application
250 kbps. CC2420 will be used together with a
microcontroller and a few external passive
The CC2420 is a low-cost, highly integrated components.
solution for robust wireless communication
in the 2.4 GHz unlicensed ISM band. It CC2420 is based on Chipcon’s SmartRF-
complies with worldwide regulations 03 technology in 0.18 m CMOS.
covered by ETSI EN 300 328 and EN 300
440 class 2 (Europe), FCC CFR47 Part 15
(US) and ARIB STD-T66 (Japan).
Key Features
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Table of contents
1 Abbreviations _________________________________________________________________ 5
2 References ___________________________________________________________________ 6
3 Features _____________________________________________________________________ 7
4 Absolute Maximum Ratings _____________________________________________________ 8
5 Operating Conditions __________________________________________________________ 8
6 Electrical Specifications ________________________________________________________ 9
6.1 Overall ___________________________________________________________________ 9
6.2 Transmit Section ___________________________________________________________ 9
6.3 Receive Section ___________________________________________________________ 10
6.4 RSSI / Carrier Sense _______________________________________________________ 11
6.5 IF Section ________________________________________________________________ 11
6.6 Frequency Synthesizer Section _______________________________________________ 11
6.7 Digital Inputs/Outputs ______________________________________________________ 12
6.8 Voltage Regulator _________________________________________________________ 13
6.9 Battery Monitor ___________________________________________________________ 13
6.10 Power Supply _____________________________________________________________ 13
7 Pin Assignment ______________________________________________________________ 15
8 Circuit Description ___________________________________________________________ 17
9 Application Circuit ___________________________________________________________ 19
9.1 Input / output matching _____________________________________________________ 19
9.2 Bias resistor ______________________________________________________________ 19
9.3 Crystal __________________________________________________________________ 19
9.4 Voltage regulator __________________________________________________________ 19
9.5 Power supply decoupling and filtering _________________________________________ 19
10 IEEE 802.15.4 Modulation Format ____________________________________________ 24
11 Configuration Overview _____________________________________________________ 25
12 Evaluation Software ________________________________________________________ 26
13 4-wire Serial Configuration and Data Interface __________________________________ 27
13.1 Pin configuration __________________________________________________________ 27
13.2 Register access ____________________________________________________________ 27
13.3 Status byte _______________________________________________________________ 28
13.4 Command strobes _________________________________________________________ 29
13.5 RAM access ______________________________________________________________ 29
13.6 FIFO access ______________________________________________________________ 31
13.7 Multiple SPI access ________________________________________________________ 31
14 Microcontroller Interface and Pin Description ___________________________________ 32
14.1 Configuration interface _____________________________________________________ 32
14.2 Receive mode_____________________________________________________________ 33
14.3 RXFIFO overflow _________________________________________________________ 33
14.4 Transmit mode ____________________________________________________________ 34
14.5 General control and status pins _______________________________________________ 35
15 Demodulator, Symbol Synchroniser and Data Decision ___________________________ 35
16 Frame Format _____________________________________________________________ 36
16.1 Synchronisation header _____________________________________________________ 36
16.2 Length field ______________________________________________________________ 37
16.3 MAC protocol data unit _____________________________________________________ 37
16.4 Frame check sequence ______________________________________________________ 38
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17 RF Data Buffering __________________________________________________________ 39
17.1 Buffered transmit mode _____________________________________________________ 39
17.2 Buffered receive mode ______________________________________________________ 39
17.3 Unbuffered, serial mode ____________________________________________________ 40
18 Address Recognition ________________________________________________________ 41
19 Acknowledge Frames _______________________________________________________ 41
20 Radio control state machine __________________________________________________ 43
21 MAC Security Operations (Encryption and Authentication) _______________________ 45
21.1 Keys ____________________________________________________________________ 45
21.2 Nonce / counter ___________________________________________________________ 45
21.3 Stand-alone encryption _____________________________________________________ 46
21.4 In-line security operations ___________________________________________________ 46
21.5 CTR mode encryption / decryption ____________________________________________ 47
21.6 CBC-MAC_______________________________________________________________ 47
21.7 CCM ___________________________________________________________________ 47
21.8 Timing __________________________________________________________________ 48
22 Linear IF and AGC Settings __________________________________________________ 48
23 RSSI / Energy Detection _____________________________________________________ 48
24 Link Quality Indication______________________________________________________ 49
25 Clear Channel Assessment ___________________________________________________ 50
26 Frequency and Channel Programming _________________________________________ 50
27 VCO and PLL Self-Calibration _______________________________________________ 51
27.1 VCO____________________________________________________________________ 51
27.2 PLL self-calibration ________________________________________________________ 51
28 Output Power Programming _________________________________________________ 51
29 Voltage Regulator __________________________________________________________ 51
30 Battery Monitor ____________________________________________________________ 52
31 Crystal Oscillator___________________________________________________________ 53
32 Input / Output Matching _____________________________________________________ 54
33 Transmitter Test Modes _____________________________________________________ 55
33.1 Unmodulated carrier _______________________________________________________ 55
33.2 Modulated spectrum _______________________________________________________ 56
34 System Considerations and Guidelines _________________________________________ 57
34.1 Frequency hopping and multi-channel systems ___________________________________ 57
34.2 Data burst transmissions ____________________________________________________ 57
34.3 Crystal accuracy and drift ___________________________________________________ 57
34.4 Communication robustness __________________________________________________ 57
34.5 Communication security ____________________________________________________ 57
34.6 Low-cost systems __________________________________________________________ 58
34.7 Battery operated systems ____________________________________________________ 58
34.8 BER / PER measurements ___________________________________________________ 58
35 PCB Layout Recommendations _______________________________________________ 59
36 Antenna Considerations _____________________________________________________ 59
37 Configuration Registers _____________________________________________________ 61
38 Test Output Signals _________________________________________________________ 81
39 Package Description (QLP 48) __________________________ Error! Bookmark not defined.
40 Recommended layout for package (QLP 48) ______________ Error! Bookmark not defined.
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40.1 Package thermal properties __________________________ Error! Bookmark not defined.
40.2 Soldering information ______________________________________________________ 83
40.3 Plastic tube specification ____________________________ Error! Bookmark not defined.
40.4 Carrier tape and reel specification _____________________ Error! Bookmark not defined.
41 Ordering Information _________________________________ Error! Bookmark not defined.
42 General Information ________________________________________________________ 84
42.1 Document History _________________________________________________________ 84
42.2 Product Status Definitions ___________________________ Error! Bookmark not defined.
43 Address Information __________________________________ Error! Bookmark not defined.
44 TI Worldwide Technical Support _______________________ Error! Bookmark not defined.
Important Notice ___________________________________________ Error! Bookmark not defined.
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1 Abbreviations
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RX - Receive
SHR - Synchronisation Header
SPI - Serial Peripheral Interface
TBD - To Be Decided / To Be Defined
T/R - Transmit / Receive
TX - Transmit
VCO - Voltage Controlled Oscillator
VGA - Variable Gain Amplifier
2 References
[1] IEEE std. 802.15.4 - 2003: Wireless Medium Access Control (MAC) and
Physical Layer (PHY) specifications for Low Rate Wireless Personal Area
Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2003.pdf
[2] NIST FIPS Pub 197: Advanced Encryption Standard (AES), Federal
Information Processing Standards Publication 197, US Department of
Commerce/N.I.S.T., November 26, 2001. Available from the NIST website.
http://csrc.nist.gov/publications/fips/fips197/fips-197.pdf
http://csrc.nist.gov/CryptoToolkit/modes/proposedmodes/ProposedModesPag
e.html
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3 Features
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Voltage on any digital I/O pin, (pin no. 21, 27-34 -0.3 VDDIO+0.3, max 3.6 V
and 41)
Voltage on any other pin, (pin no. 6, 7, 8, 11, 12, -0.3 VDD+0.3, max 2.0 V
13, 16, 36, 38, 39, 40, 45, 46 and 47)
The absolute maximum ratings given the limiting values may cause permanent
above should under no circumstances be damage to the device.
violated. Stress exceeding one or more of
5 Operating Conditions
Supply voltage (VDDIO) for digital I/Os, DVDD3.3, 1.6 3.6 V The digital I/O voltage (DVDD3.3 pin)
pin 25 . must match the external interfacing
circuit (e.g. microcontroller).
Supply voltage (VDD) on AVDD_VCO, DVDD1.8, 1.6 1.8 2.0 V The typical application uses regulated
etc (pin no 1, 2, 3, 4, 10, 14, 15, 17, 18, 20, 26, 35, 1.8 V supply generated by the on-chip
37, 44 and 48) voltage regulator.
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6 Electrical Specifications
Measured on CC2420 EM with transmission line balun, T A = 25 C, DVDD3.3 and VREG_IN = 3.3 V, internal
voltage regulator used if nothing else stated.
6.1 Overall
Parameter Min. Typ. Max. Unit Condition / Note
Harmonics
2nd harmonic -44 dBm Measured conducted with 1 MHz
rd resolution bandwidth on
3 harmonic -64 dBm spectrum analyser. At max output
power delivered to a single
ended 50 load through a balun.
See page 54.
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6.3 Receive Section
Parameter Min. Typ. Max. Unit Condition / Note
Receiver Sensitivity
-90 -95 dBm PER = 1%, as specified by [1]
Measured in a 50 single-ended
load through a balun.
[1] requires –85 dBm
Saturation (maximum input level) 0 10 dBm PER = 1%, as specified by [1]
Measured in a 50 single–ended
load through a balun.
[1] requires –20 dBm
Blocking / Desensitisation
+/- 5 MHz from band edge -28 dBm Wanted signal 3 dB above the
+/- 20 MHz from band edge -28 dBm sensitivity level, CW jammer,
+/- 30 MHz from band edge -27 dBm PER = 1%. Complies with EN
+/- 50 MHz from band edge -28 dBm 300 440 class 2.
Spurious emission
30 – 1000 MHz -73 dBm Conducted measurement in a 50
1 – 12.75 GHz -58 dBm single ended load. Measured
according to EN 300 328, EN
300 440 class 2, FCC CFR47,
Part 15 and ARIB STD-T-66
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Parameter Min. Typ. Max. Unit Condition / Note
RSSI linearity 3 dB
6.5 IF Section
Parameter Min. Typ. Max. Unit Condition / Note
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Parameter Min. Typ. Max. Unit Condition / Note
Crystal ESR 60
PLL lock time 192 s The startup time from the crystal
oscillator is running and RX / TX
turnaround time
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Step size 50 mV
Hysteresis 10 mV
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Parameter Min. Typ. Max. Unit Condition / Note
Current Consumption,
transmit mode:
P = -25 dBm 8.5 mA The output power is delivered
P = -15 dBm 9.9 mA differentially to a 50 singled
P = -10 dBm 11 mA ended load through a balun, see
P = −5 dBm 14 mA also page 54.
P = 0 dBm 17.4 mA
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7 Pin Assignment
AVDD_XOSC16
XOSC16_Q1
XOSC16_Q2
VREG_OUT
AVDD_CHP
VREG_EN
AVDD_IF1
VREG_IN
ATEST1
ATEST2
R_BIAS
NC
37
48
47
46
45
44
43
42
41
40
39
38
VCO_GUARD 1 36 NC
AVDD_VCO 2 35 DVDD_RAM
AVDD_PRE 3 34 SO
AVDD_RF1 4 33 SI
GND 5 32 SCLK
RF_P
TXRX_SWITCH
6
7 CC2420 QLP48
7x7
31
30
CSn
FIFO
RF_N 8 29 FIFOP
GND 9 28 CCA
AVDD_SW 10 27 SFD
NC 11 26 DVDD1.8
NC 12 25 DVDD3.3
13
24
14
18
20
21
22
23
15
16
17
19
NC
DVDD_ADC
DGND_GUARD
DGND
DSUB_PADS
DSUB_CORE
AVDD_ADC
DGUARD
AVDD_IF2
RESETn
AVDD_RF2
NC
AGND
Exposed die
attach pad
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Pin Pin Name Pin type Pin Description
15 AVDD_IF2 Power (analog) 1.8 V Power supply for transmit / receive IF chain
16 NC - Not Connected
17 AVDD_ADC Power (analog) 1.8 V Power supply for analog parts of ADCs and DACs
18 DVDD_ADC Power (digital) 1.8 V Power supply for digital parts of receive ADCs
19 DGND_GUARD Ground (digital) Ground connection for digital noise isolation
20 DGUARD Power (digital) 1.8 V Power supply connection for digital noise isolation
21 RESETn Digital Input Asynchronous, active low digital reset
22 DGND Ground (digital) Ground connection for digital core and pads
23 DSUB_PADS Ground (digital) Substrate connection for digital pads
24 DSUB_CORE Ground (digital) Substrate connection for digital modules
25 DVDD3.3 Power (digital) 3.3 V Power supply for digital I/Os
26 DVDD1.8 Power (digital) 1.8 V Power supply for digital core
27 SFD Digital output SFD (Start of Frame Delimiter) / digital mux output
28 CCA Digital output CCA (Clear Channel Assessment) / digital mux output
29 FIFOP Digital output Active when number of bytes in FIFO exceeds threshold /
serial RF clock output in test mode
30 FIFO Digital I/O Active when data in FIFO /
serial RF data input / output in test mode
31 CSn Digital input SPI Chip select, active low
32 SCLK Digital input SPI Clock input, up to 10 MHz
33 SI Digital input SPI Slave Input. Sampled on the positive edge of SCLK
34 SO Digital output SPI Slave Output. Updated on the negative edge of SCLK.
(tristate) Tristate when CSn high.
35 DVDD_RAM Power (digital) 1.8 V Power supply for digital RAM
36 NC - Not Connected
37 AVDD_XOSC16 Power (analog) 1.8 V crystal oscillator power supply
38 XOSC16_Q2 Analog I/O 16 MHz Crystal oscillator pin 2
39 XOSC16_Q1 Analog I/O 16 MHz Crystal oscillator pin 1 or external clock input
40 NC - Not Connected
41 VREG_EN Digital input Voltage regulator enable, active high, held at VREG_IN
voltage level when active. Note that VREG_EN is relative
VREG_IN, not DVDD3.3.
42 VREG_OUT Power output Voltage regulator 1.8 V power supply output
43 VREG_IN Power (analog) Voltage regulator 2.1 to 3.6 V power supply input
44 AVDD_IF1 Power (analog) 1.8 V Power supply for transmit / receive IF chain
45 R_BIAS Analog output External precision resistor, 43 k, 1 %
46 ATEST2 Analog I/O Analog test I/O for prototype and production testing
47 ATEST1 Analog I/O Analog test I/O for prototype and production testing
48 AVDD_CHP Power (analog) 1.8 V Power supply for phase detector and charge pump
NOTES:
The exposed die attach pad must be connected to a solid ground plane as this is the main ground connection for the
chip.
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8 Circuit Description
DIGITAL
ADC DEMODULATOR
TX/RX CONTROL
CONTROL LOGIC
SmartRF
microcontroller
DIGITAL
INTERFACE
interface
0 FREQ
CC2420
Serial
WITH FIFO
90 SYNTH BUFFERS,
CRC AND
ENCRYPTION
TX POWER CONTROL
DAC DIGITAL
Power MODULATOR
Control Digital and
PA - Data spreading
- Modulation
Analog test
interface
XOSC DAC
On-chip
BIAS
16 MHz
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degrees phase splitter for generating the I The digital baseband includes support for
and Q LO signals to the down-conversion frame handling, address recognition, data
mixers in receive mode and up-conversion buffering and MAC security.
mixers in transmit mode. The VCO
operates in the frequency range 4800 – The 4-wire SPI serial interface is used for
4966 MHz, and the frequency is divided by configuration and data buffering.
two when split in I and Q.
An on-chip voltage regulator delivers the
A crystal must be connected to regulated 1.8 V supply voltage. The
XOSC16_Q1 and XOSC16_Q2 and voltage regulator may be enabled /
provides the reference frequency for the disabled through a separate pin.
synthesizer. A digital lock signal is
available from the PLL. A battery monitor may optionally be used
to monitor the unregulated power supply
voltage. The battery monitor is
configurable through the SPI interface.
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9 Application Circuit
Few external components are required for If a balanced antenna such as a folded
the operation of CC2420. A typical dipole is used, the balun can be omitted. If
application circuit is shown in Figure 4. the antenna also provides a DC path from
The external components shown are the TXRX_SWITCH pin to the RF pins,
described in Table 1 and typical values are inductors are not needed for DC bias.
given in Table 2. Note that most
decoupling capacitors are not shown on Figure 5 shows a suggested application
the application circuits. For the complete circuit using a differential antenna. The
reference design please refer to Texas antenna type is a standard folded dipole.
Instrument’s web site: http://www.ti.com. The dipole has a virtual ground point;
hence bias is provided without degradation
in antenna performance.
9.1 Input / output matching
The RF input/output is high impedance
9.2 Bias resistor
and differential. The optimum differential
load for the RF port is 95+j187 . The bias resistor R451 is used to set an
accurate bias current.
When using an unbalanced antenna such
as a monopole, a balun should be used in
9.3 Crystal
order to optimise performance. The balun
can be implemented using low-cost An external crystal with two loading
discrete inductors and capacitors only or in capacitors (C381 and C391) is used for
combination with transmission lines. the crystal oscillator. See page 53 for
details.
Figure 3 shows the balun implemented in a
two-layer reference design. It consists of a
half wave transmission line, C81, L61, L71 9.4 Voltage regulator
and L81. The circuit will present the The on chip voltage regulator supplies all
optimum RF termination to CC2420 with a 1.8 V power supply inputs. C42 is required
50 load on the antenna connection. This for stability of the regulator. A series
circuit has improved EVM performance, resistor may be used to comply with the
sensitivity and harmonic suppression ESR requirement.
compared to the design in Figure 4.
Please refer to the input/output matching
9.5 Power supply decoupling and
section on page 54 for more details.
filtering
The balun in Figure 4 consists of C61, Proper power supply decoupling must be
C62, C71, C81, L61, L62 and L81, and will used for optimum performance. The
present the optimum RF termination to placement and size of the decoupling
CC2420 with a 50 load on the antenna capacitors and the power supply filtering
connection. A low pass filter may be added are very important to achieve the best
to add margin to the FCC requirement on performance in an application. Texas
second harmonic level. Instruments provides a compact reference
design that should be followed very
closely..
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Ref Description
3.3 V
Power
supply
C391 C381
C42
R451
XTAL
AVDD_XOSC16 37
AVDD_CHP 48
ATEST1 47
ATEST2 46
R_BIAS 45
AVDD_IF1 44
VREG_IN 43
VREG_OUT 42
VREG_EN 41
NC 40
XOSC16_Q1 39
XOSC16_Q2 38
1 VCO_GUARD NC 36
2 AVDD_VCO DVDD_RAM 35
Antenna 3 AVDD_PRE SO 34
(50 Ohm) 4 AVDD_RF1 SI 33
5 GND
CC2420 SCLK 32
8 RF_N FIFOP 29
9 GND CCA 28
10 AVDD_SW SFD 27
11 NC DVDD1.8 26
DGND_GUARD 19
DSUB_PADS 23
DSUB_CORE 24
AVDD_RF2 14
AVDD_IF2 15
AVDD_ADC 17
DVDD_ADC 18
12 NC DVDD3.3 25
RESETn 21
DGUARD 20
DGND 22
NC 13
NC 16
Figure 3. Typical application circuit with transmission line balun for single-ended
operation
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3.3 V
Power
supply
C391 C381
R451
C42 XTAL
AVDD_XOSC16 37
AVDD_CHP 48
ATEST1 47
ATEST2 46
R_BIAS 45
AVDD_IF1 44
VREG_IN 43
VREG_OUT 42
VREG_EN 41
NC 40
XOSC16_Q1 39
XOSC16_Q2 38
1 VCO_GUARD NC 36
2 AVDD_VCO DVDD_RAM 35
3 AVDD_PRE SO 34
Antenna
(50 Ohm) 4 AVDD_RF1 SI 33
C61
5 GND
CC2420 SCLK 32
Digital Interface
8 RF_N FIFOP 29
10 AVDD_SW SFD 27
C81
11 NC DVDD1.8 26
DGND_GUARD 19
DSUB_PADS 23
DSUB_CORE 24
AVDD_RF2 14
AVDD_IF2 15
AVDD_ADC 17
DVDD_ADC 18
12 NC DVDD3.3 25
RESETn 21
DGUARD 20
DGND 22
NC 13
NC 16
Figure 4. Typical application circuit with discrete balun for single-ended operation
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3.3 V
Power
supply
C391 C381
R451
C42 XTAL
AVDD_XOSC16 37
AVDD_CHP 48
ATEST1 47
ATEST2 46
R_BIAS 45
AVDD_IF1 44
VREG_IN 43
VREG_OUT 42
VREG_EN 41
NC 40
XOSC16_Q1 39
XOSC16_Q2 38
1 VCO_GUARD NC 36
2 AVDD_VCO DVDD_RAM 35
3 AVDD_PRE SO 34
4 AVDD_RF1 SI 33
5 GND
CC2420 SCLK 32
Digital Interface
8 RF_N FIFOP 29
9 GND CCA 28
10 AVDD_SW SFD 27
11 NC DVDD1.8 26
DGND_GUARD 19
DSUB_PADS 23
DSUB_CORE 24
AVDD_RF2 14
AVDD_IF2 15
AVDD_ADC 17
DVDD_ADC 18
12 NC DVDD3.3 25
RESETn 21
DGUARD 20
DGND 22
NC 13
NC 16
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C42 10 μF, 0.5 < ESR < 5 10 μF, 0.5 < ESR < 5 10 μF, 0.5 < ESR < 5
C61 Not used 0.5 pF, +/- 0.25pF, NP0, 0402 Not used
C62 Not used 5.6 pF, +/- 0.25pF, NP0, 0402 Not used
C71 Not used 5.6 pF, 10%, X5R, 0402 Not used
C81 5.6 pF, +/- 0.25pF, NP0, 0402 0.5 pF, +/- 0.25pF, NP0, 0402 Not used
C381 27 pF, 5%, NP0, 0402 27 pF, 5%, NP0, 0402 27 pF, 5%, NP0, 0402
C391 27 pF, 5%, NP0, 0402 27 pF, 5%, NP0, 0402 27 pF, 5%, NP0, 0402
L61 8.2 nH, 5%, 7.5 nH, 5%, 27 nH, 5%, Monolithic/multilayer,
Monolithic/multilayer, 0402 Monolithic/multilayer, 0402 0402
L62 Not used 5.6 nH, 5%, Not used
Monolithic/multilayer, 0402
L71 22 nH, 5%, Not used 12 nH, 5%, Monolithic/multilayer,
Monolithic/multilayer, 0402 0402
L81 1.8 nH, +/- 0.3nH, 7.5 nH, 5%, Not used
Monolithic/multilayer, 0402 Monolithic/multilayer, 0402
R451 43 k, 1%, 0402 43 k, 1%, 0402 43 k, 1%, 0402
XTAL 16 MHz crystal, 16 pF load 16 MHz crystal, 16 pF load 16 MHz crystal, 16 pF load (CL),
(CL), (CL), ESR < 60
ESR < 60 ESR < 60
Table 2. Bill of materials for the application circuits
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Transmitted
Bit-to- Symbol- O-QPSK Modulated
bit-stream
Symbol to-Chip Modulator Signal
(LSB first)
0 11011001110000110101001000101110
1 11101101100111000011010100100010
2 00101110110110011100001101010010
3 00100010111011011001110000110101
4 01010010001011101101100111000011
5 00110101001000101110110110011100
6 11000011010100100010111011011001
7 10011100001101010010001011101101
8 10001100100101100000011101111011
9 10111000110010010110000001110111
10 01111011100011001001011000000111
11 01110111101110001100100101100000
12 00000111011110111000110010010110
13 01100000011101111011100011001001
14 10010110000001110111101110001100
15 11001001011000000111011110111000
Table 3. IEEE 802.15.4 symbol-to-chip mapping [1]
The modulation format is Offset – is shaped as a half-sine, transmitted
Quadrature Phase Shift Keying (O-QPSK) alternately in the I and Q channels with
with half-sine chip shaping. This is one half chip period offset. This is
equivalent to MSK modulation. Each chip illustrated for the zero-symbol in Figure 7.
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TC
I-phase 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1
Q-phase 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 0
2TC
11 Configuration Overview
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12 Evaluation Software
Texas Instruments (TI) provides users of Studio can be downloaded from TI’s web
CC2420 with a software program, page: http://www.ti.com. Figure 8 shows
the user interface of the CC2420
®
SmartRF Studio (Windows interface)
which may be used for radio performance configuration software.
and functionality evaluation. SmartRF®
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CC2420 is configured via a simple 4-wire RAM/Register bit (set to 0 for register
SPI-compatible interface (pins SI, SO, access), followed by the R/W bit (0 for
SCLK and CSn) where CC2420 is the slave. write, 1 for read). The following 6 bits are
This interface is also used to read and the address-bits (A5:0). A5 is the most
write buffered data (see page 39). All significant bit of the address and is sent
address and data transfer on the SPI first. The 16 data-bits are then transferred
interface is done most significant bit first. (D15:0), also MSB first. See Figure 9 for
an illustration.
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tsp tch tcl tsd thd tns
SCLK
CSn
Write to register / RXFIFO:
SI 0 0 A5 A4 A3 A2 A1 A0 X DW15 DW14 DW13 DW12 DW11 DW10 DW9 DW8 X DW7 DW6 DW5 DW4 DW3 DW2 DW1 DW0 X
S7 S6 S5 S4 S3 S2 S1 S0 X
SO
Write to TXFIFO:
SI 0 0 A5 A4 A3 A2 A1 A0 X DW7 DW6 DW5 DW4 DW3 DW2 DW1 DW0 X DW7 DW6 DW5 DW4 DW3 DW2 DW1 DW0 X
S7 S6 S5 S4 S3 S2 S1 S0 S7 S6 S5 S4 S3 S2 S1 S0 S7 S6 S5 S4 S3 S2 S1 S0 S7
SO
SI 0 1 A5 A4 A3 A2 A1 A0 X
SO S7 S6 S5 S4 S3 S2 S1 S0 DR15 DR14 DR13 DR12 DR11 DR10 DR9 DR8 DR7 DR6 DR5 DR4 DR3 DR2 DR1 DR0 DR15
Read and write one byte to RAM: (multiple read / writes also possible)
SI 1 A6 A5 A4 A3 A2 A1 A0 X B1 B0 1 X X X X X X
CSn setup tsp 25 ns The minimum time CSn must be low before the
time first positive edge of SCLK.
CSn hold time tns 25 ns The minimum time CSn must be held low after the
last negative edge of SCLK.
SI hold time thd 25 ns The minimum time data must be held at SI, after
the positive edge of SCLK.
Rise time trise 100 ns The maximum rise time for SCLK and CSn
Fall time tfall 100 ns The maximum fall time for SCLK and CSn
SWRS041c Page 28 of 85
Not Recommended For New Designs
CC2420
chip functions such as register or FIFO access.
SWRS041c Page 29 of 85
Not Recommended For New Designs
CC2420
address consists of two parts, B1:0 (MSB) For RAM read, the selected byte(s) are
selecting one of the three memory banks output on the SO pin directly after the
and A6:0 (LSB) selecting the address second address byte.
within the selected bank. The RAM is
divided into three memory banks: TXFIFO See Figure 10 for an illustration on how
(bank 0), RXFIFO (bank 1) and security multiple RAM bytes may be read or written
(bank 2). The FIFO banks are 128 bytes in one operation.
each, while the security bank is 112 bytes.
The RAM memory space is shown in
A6:0 is transmitted directly after the Table 6. The lower 256 bytes are used to
RAM/Register bit as shown in Figure 9. store FIFO data. Note that RAM access
For RAM access, a second byte is also should never be used for FIFO write
required before the data transfer. This byte operations because the FIFO counter will
contains B1:0 in bits 7 and 6, followed by not be updated. Use RXFIFO and TXFIFO
the R/W bit (0 for read+write, 1 for read). access instead as described in section
Bits 4 through 0 are don’t care as shown in FIFO access.
Figure 9.
As with register data, data stored in RAM
For RAM write, data to be written must be will be retained during power down mode,
input on the SI pin directly after the but not when the power-supply is turned
second address byte. RAM data read is off (e.g. by disabling the voltage regulator
output on the SO pin simultaneously, but using the VREG_EN pin).
may be ignored by the user if only writing
is of interest.
CSn:
Multiple command strobes: ADDR ADDR ADDR ... ... ADDR ADDR
Multiple register read or write ADDR DATA8MSB DATA8LSB ADDR DATA8MSB ... ADDR DATA8MSB DATA8LSB
Read or write n bytes from/to RF FIFO: ADDRFIFO DATAbyte0 DATAbyte1 DATAbyte2 DATAbyte3 ... DATAbyte n-3 DATAbyte n-2 DATAbyte n-1
Read or write n bytes from/to RAM: ADDRLRAM ADDRHRAM DATAADDR DATAADDR+1 DATAADDR+2 ... DATAADDR+n
Note: FIFO and RAM access must be terminated with setting the CSn pin high.
Command strobes and register access may be followed by any other access,
since they are completed on the last negative edge on SCLK. They may however also be
terminated with setting CSn high, if desirable, e.g. for reading only 8 bits from a configuration
register.
Figure 10. Configuration registers write and read operations via SPI
SWRS041c Page 30 of 85
Not Recommended For New Designs
CC2420
Address Byte Ordering Name Description
When writing to the TXFIFO, the status 13.7 Multiple SPI access
byte (see Table 5) is output for each new Register access, command strobes, FIFO
data byte on SO, as shown in Figure 9. access and RAM access may be issued
This could be used to detect TXFIFO continuously without setting CSn high.
underflow (see section RF Data Buffering E.g. the user may issue a command
section on page 39) while writing data to strobe, a register write and writing 3 bytes
the TXFIFO. to the TXFIFO in one operation, as
illustrated in Figure 11. The only exception
Multiple FIFO bytes may be accessed in is that FIFO and RAM access must be
one operation, as with the RAM access. terminated by setting CSn high.
SWRS041c Page 31 of 85
Not Recommended For New Designs
CC2420
CSn
When used in a typical system, CC2420 will microcontroller uses 4 I/O pins for the SPI
interface to a microcontroller. This configuration interface (SI, SO, SCLK and
microcontroller must be able to: CSn). SO should be connected to an input
at the microcontroller. SI, SCLK and CSn
Program CC2420 into different modes, must be microcontroller outputs.
read and write buffered data, and read Preferably the microcontroller should have
back status information via the 4-wire a hardware SPI interface.
SPI-bus configuration interface (SI, SO,
SCLK and CSn). The microcontroller pins connected to SI,
SO and SCLK can be shared with other
Interface to the receive and transmit SPI-interface devices. SO is a high
FIFOs using the FIFO and FIFOP impedance output as long as CSn is not
status pins. activated (active low).
Interface to the CCA pin for clear CSn should have an external pull-up
channel assessment. resistor or be set to a high level when the
voltage regulator is turned off in order to
Interface to the SFD pin for timing prevent the input from floating. SI and
information (particularly for beaconing SCLK should be set to a defined level to
networks). prevent the inputs from floating.
C
CC2420
FIFO GIO0
FIFOP Interrupt
CCA GIO1
SFD Timer Capture
CSn GIO2
SI MOSI
SO MISO
SCLK SCLK
SWRS041c Page 32 of 85
Not Recommended For New Designs
CC2420
SWRS041c Page 33 of 85
Not Recommended For New Designs
CC2420
ed on
iv iti
ce gn
e d re
eco U d
ct te r
te by s d PD eive
de th es te t M rec
ng dr le s
S F D
Le Ad omp La yte
c b
Data received over RF Preamble SFD Length MAC Protocol Data Unit (MPDU) with correct address
Address
recognition OK SFD Pin
FIFO Pin
Data received over RF Preamble SFD Length MAC Protocol Data Unit (MPDU) with wrong address
Address
recognition fails SFD Pin
FIFO Pin
FIFOP Pin
n
gh f he
hi r o w te
ins be HR o w by
a l st
m um _T es la
re n P go t of
P as IFO
FO ng F FO ou
FI s lo s > FI ad s
a yte re tart
b s
SCLK
SFD
CSn
SI ADDRTXFIFO - - - - - - - - -
SO Status Length PSDU0 PSDU1 PSDU2 PSDU3 PSDU4 PSDU5 RSSI FCS/Corr
FIFOP
FIFO
SWRS041c Page 34 of 85
Not Recommended For New Designs
CC2420
d or
an d
m ed U itte
m itt
co sm PD sm w
N n M n f lo
XO e tra st tra er
ST trob D La yte nd
s SF b Xu
T
Data transmitted
Preamble SFD Length MAC Protocol Data Unit (MPDU)
over RF
SFD Pin
CRC generated
12 symbol periods Automatically generated Data fetched by CC2420
preamble and SFD from TXFIFO
The SFD pin can be used to extract the The polarity of FIFO, FIFOP, SFD and CCA
timing information of transmitted and can be controlled by the IOCFG0 register
(address 0x1C).
SWRS041c Page 35 of 85
Not Recommended For New Designs
CC2420
Digital Frequency Digital Symbol Data
I / Q Analog
ADC IF Channel Offset Data Correlators and Symbol
IF signal
Filtering Compensation Filtering Synchronisation Output
Average
RSSI Correlation
RSSI
Generator Value (may be
used for LQI)
16 Frame Format
CC2420 has hardware support for parts of Figure 17 [1] shows a schematic view of
the IEEE 802.15.4 frame format. This the IEEE 802.15.4 frame format. Similar
section gives a brief summary to the IEEE figures describing specific frame formats
802.15.4 frame format, and describes how (data frames, beacon frames,
CC2420 is set up to comply with this. acknowledgment frames and MAC
command frames) are included in [1].
Bytes: 2 1 0 to 20 n 2
MAC Frame Data Frame Check
Address
Layer Control Field Sequence Frame payload Sequence
Information
(FCF) Number (FCS)
MAC Header (MHR) MAC Payload MAC Footer
(MFR)
Bytes: 4 1 1 5 + (0 to 20) + n
Start of frame MAC Protocol
PHY Preamble Frame
Delimiter Data Unit
Layer Sequence Length
(SFD) (MPDU)
Synchronisation Header PHY Header PHY Service Data Unit
(SHR) (PHR) (PSDU)
11 + (0 to 20) + n
PHY Protocol Data Unit
(PPDU)
Figure 17. Schematic view of the IEEE 802.15.4 Frame Format [1]
In CC2420, the preamble length and SFD is The programmable preamble length only
configurable. The default values are applies to transmission, it does not affect
compliant with [1]. Changing these values receive mode. The preamble length should
will make the system non-compliant to not be set shorter than the default value.
IEEE 802.15.4. Note that 2 of the 8 zero-symbols in the
preamble sequence required by [1] are
A synchronisation header is always included in the SYNCWORD register so that
transmitted first in all transmit modes. the CC2420 preamble sequence is only 6
symbols long for compliance with [1]. Two
SWRS041c Page 36 of 85
Not Recommended For New Designs
CC2420
additional zero symbols in SYNCWORD A. If SYNCWORD = 0xA70F, CC2420 will
make CC2420 compliant with [1]. require the incoming symbol sequence of
(from left to right) 0 0 7 A. If SYNCWORD =
In reception, CC2420 synchronises to 0xA700, CC2420 will require the incoming
received zero-symbols and searches for symbol sequence of (from left to right) 0 0
the SFD sequence defined by the 0 7 A.
SYNCWORD register. The least significant
symbols in SYNCWORD set to 0xF will be In receive mode CC2420 uses the
ignored, while symbols different from 0xF preamble sequence for symbol
will be required for synchronisation. The synchronisation and frequency offset
default setting of 0xA70F thereby requires adjustments. The SFD is used for byte
one additional zero-symbol for synchronisation, and is not part of the data
synchronisation. This will reduce the stored in the receive buffer (RXFIFO).
number of false frames detected due to
noise.
Synchronisation Header
Preamble SFD
IEEE 802.15.4 0 0 0 0 0 0 0 0 7 A
Each box corresponds to 4 bits. Hence the preamble corresponds to 8 x 4 ''0' s or 4 bytes with the value 0.
SW0 = SYNCWORD[3:0] if different from 'F', else '0'
Data
input
(LSB
first)
r0 r1 r2 r3 r4 r5 r6 r7 r8 r9 r10 r11 r12 r13 r14 r15
Figure 20. CC2420 Frame Check Sequence (FCS) hardware implementation [1]
SWRS041c Page 38 of 85
Not Recommended For New Designs
CC2420
Length byte MPDU
RSSI
Data in RXFIFO n MPDU1 MPDU2 MPDUn-2 CRC / Corr
(signed)
Bit number 7 6 5 4 3 2 1 0
CRC
Correlation value (unsigned)
OK
17 RF Data Buffering
CC2420 can be configured for different A TXFIFO underflow is issued if too few
transmit and receive modes, as set in the bytes are written to the TXFIFO.
MDMCTRL1.TX_MODE and Transmission is then automatically
MDMCTRL1.RX_MODE control bits. stopped. The underflow is indicated in the
Buffered mode (mode 0) will be used for TX_UNDERFLOW status bit, which is
normal operation of CC2420, while other returned during each address byte and
modes are available for test purposes. each byte written to the TXFIFO. The
underflow bit is only cleared by issuing a
SFLUSHTX command strobe.
17.1 Buffered transmit mode
In buffered transmit mode (TX_MODE 0), The TXFIFO can only contain one data
the 128 byte TXFIFO, located in CC2420 frame at a given time.
RAM, is used to buffer data before
transmission. A preamble sequence After complete transmission of a data
(defined in the Frame Format section frame, the TXFIFO is automatically refilled
below) is automatically inserted before the with the last transmitted frame. Issuing a
length field during transmission. The new STXON or STXONCCA command
length field must always be the first byte strobe will then cause CC2420 to retransmit
written to the transmit buffer for all frames. the last frame.
Writing one or multiple bytes to the Writing to the TXFIFO after a frame has
TXFIFO is described in the FIFO access been transmitted will cause the TXFIFO to
section on page 31. Reading data from the be automatically flushed before the new
TXFIFO is possible with RAM access, but byte is written. The only exception is if a
this does not remove the byte from the TXFIFO underflow has occurred, then a
FIFO. SFLUSHTX command strobe is required.
Incoming / outgoing
Preamble SFD s0 s1 s2
RF data
Transmit mode: 4 us
FIFOP
FIFO (from uC) b0 b1 b2 b3 b4 b5 b6 b7 b8 b9 b10 b11 b8 b9 b10 b11
Receive mode:
FIFOP
FIFO (from CC2420) b0 b1 b2 b3 b4
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CC2420
18 Address Recognition
19 Acknowledge Frames
CC2420 includes hardware support for recognition with the acknowledge request
transmitting acknowledge frames, as flag set and a valid CRC. AUTOACK
specified in [1]. Figure 23 shows the therefore does not make sense unless
format of the acknowledge frame. also ADR_DECODE and AUTOCRC are
enabled. The sequence number is copied
If MDMCTRL0.AUTOACK is enabled, an from the incoming frame.
acknowledge frame is transmitted for all
incoming frames accepted by the address
SWRS041c Page 41 of 85
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CC2420
AUTOACK may be used for non-beacon symbol periods after the last symbol of the
systems as long as the frame pending field incoming frame. This is as specified by [1]
(see Figure 19) is cleared. The for non-beacon networks.
acknowledge frame is then transmitted 12
Bytes: 4 1 1 2 1 2
Start of Frame Frame Data Frame Check
Preamble Frame
Delimiter Control Field Sequence Sequence
Sequence Length
(SFD) (FCF) Number (FCS)
Synchronisation Header PHY Header MAC Header (MHR) MAC Footer
(SHR) (PHR) (MFR)
y
l D ar
b o PEN u nd
m K
sy AC bo
U S lot
D / fs
t PP K k of
s C c
La SA Ba
Beacon
PPDU Acknowledge
network 12
symbol
periods
Non-beacon
PPDU Acknowledge
network
SWRS041c Page 42 of 85
Not Recommended For New Designs
CC2420
CC2420 has a built-in state machine that is For test purposes, the frequency
used to switch between different synthesizer (FS) can also be manually
operational states (modes). The change of calibrated and started by using the
state is done either by using command STXCAL command strobe register. This
strobes or by internal events such as SFD will not start a transmission before a
detected in receive mode. STXON command strobe is issued. This is
not shown in Figure 25.
The radio control state machine states are
shown in Figure 25. The numbers in Enabling transmission is done by issuing a
brackets refer to the state number STXON or STXONCCA command strobe.
readable in the FSMSTATE status register.
Reading the FSMSTATE status register is Turning off RF can be accomplished by
primarily for test / debug purposes. using one of the SRFOFF or SXOSCOFF
command strobe registers.
Before using the radio in either RX or TX
mode, the voltage regulator and crystal After reset the CC2420 is in Power Down
oscillator must be turned on and become mode. All configuration registers can then
stable. The voltage regulator and crystal be programmed in order to make the chip
oscillator start-up times are given in the ready to operate at the correct frequency
Electrical Specifications section on page 9. and mode. Due to the very fast start-up
time, CC2420 can remain in Power Down
The crystal oscillator is controlled by until a transmission session is requested.
accessing the SXOSCON / SXOSCOFF
command strobes. The XOSC16M_STABLE As also described in the 4-wire Serial
bit in the status register returned during Configuration and Data Interface section
address transfer indicates whether the on page 27, the crystal oscillator must be
oscillator is running and stable or not (see running (IDLE) in order to have access to
Table 5). This status register can be polled the RAM and FIFOs.
when waiting for the oscillator to start.
SWRS041c Page 43 of 85
Not Recommended For New Designs
CC2420
Chip Reset
(pin or register)
SXOSCOFF
command strobe Crystal oscillator disabled,
Power Down (PD)
All States register access enabled,
[0]
FIFO / RAM access disabled
SXOSCON
SRFOFF
All States IDLE All RX states
except Power Down (PD) [1]
nd
CC CCA or
N
ST
A) a
XO
XO
ON N
SR
TX XO
N
(S ST
RX_CALIBRATE TX_CALIBRATE
[2 and 40] [32]
Tr
HRX
ss
SFD
ted
failed address
RX_WAIT recognition RX_FRAME TX_FRAME TXFIFO Data
[14] [16 and 40] [37, 38 and 39] is transmitted
low
erf Automatic or manual
Ov Underflow
acknowledge request
Acknowledge
completed
TX_ACK
[52, 53 and 54]
SWRS041c Page 44 of 85
Not Recommended For New Designs
CC2420
CC2420 features hardware IEEE 802.15.4 As can be seen from Table 6 on page 31,
MAC security operations. This includes KEY0 is located from address 0x100 and
counter mode (CTR) encryption / KEY1 from address 0x130.
decryption, CBC-MAC authentication and
CCM encryption + authentication. All A way of establishing the keys used for
security operations are based on AES encryption and authentication must be
encryption [2] using 128 bit keys. Security decided for each particular application.
operations are performed within the IEEE 802.15.4 does not define how this is
transmit and receive FIFOs on a frame done, it is left to the higher layer of the
basis. protocol.
SWRS041c Page 45 of 85
Not Recommended For New Designs
CC2420
CC2420 gives the user full flexibility in The frame counter part of the nonce must
selecting the flags for both nonces. The be incremented for each new packet by
flag setting is stored in the most significant software.
byte of the nonce. The flag byte used for
encryption and authentication is then
generated as shown in Figure 26.
MSB in CC2420 nonce RAM
7 6 5 4 3 2 1 0
CTR Flag CBC Flag
- L SECCTRL0.SEC_M
bits 7:6 bits 7:6
Note that RAM write operations also When enabled, TX in-line security is
output data currently in RAM, so that a started in one of two ways:
new plaintext may be written at the same
time as reading out the previous Issue a STXENC command strobe. In-
ciphertext. line security will be performed within
the TXFIFO, but a RF transmission will
21.4 In-line security operations not be started. Ciphertext may be read
back using RAM read operations.
CC2420 can do MAC security operations Issue a STXON or STXONCCA
(encryption, decryption and authentication) command strobe. In-line security will
on frames within the TXFIFO and RXFIFO. be performed within the TXFIFO and a
These operations are called in-line RF transmission of the ciphertext is
security operations. started.
SWRS041c Page 46 of 85
Not Recommended For New Designs
CC2420
Issue a SRXDEC command strobe. The TXFIFO at all, and data will be encrypted
first frame in the RXFIFO is then as it is written to the TXFIFO.
decrypted / authenticated as set by the
current security mode. When decryption is initiated with a
SRXDEC command strobe, the ciphertext of
RX in-line security operations are always the RXFIFO is then decrypted as specified
performed on the first frame currently by [1].
inside the RXFIFO, even if parts of this
have already been read out over the SPI
21.6 CBC-MAC
interface. This allows the receiver to first
read the source address out to decide CBC-MAC in-line authentication is
which key to use before doing provided by CC2420 hardware.
authentication of the complete frame. In
CTR or CCM mode it is of course SECCTRL0.SEC_M sets the MIC length M,
important that bytes to be decrypted are encoded as (M-2)/2.
not read out before the security operation
is started. When enabling CBC-MAC in-line TXFIFO
authentication, the generated MIC is
When the SRXDEC command strobe is written to the TXFIFO for transmission.
issued, the FIFO and FIFOP pins will go The frame length must include the MIC.
inactive. This is to indicate to the
microcontroller that no further data may be SECCTRL1.SEC_TXL / SEC_RXL sets the
read out before the next byte to be read number of bytes between the length field
has undergone the requested security and the first byte to be authenticated,
operation. normally set to 0 for MAC authentication.
SWRS041c Page 47 of 85
Not Recommended For New Designs
CC2420
above. The only differences are from the 21.8 Timing
requirements in [1] for CCM.
Table 8 shows some examples of the time
used by the security module for different
operations.
CCM 50 69 8 222
CTR - 15 - 99
CBC 17 98 12 99
Stand- - 16 - 14
alone
Table 8. Security timing examples
CC2420 is based on a linear IF chain where The AGC characteristics are set through
the signal amplification is done in an the AGCCTRL, AGCTST0, AGCTST1 and
analog VGA (variable gain amplifier). The AGCTST2 registers. The reset values
gain of the VGA is digitally controlled. should be used for all AGC control and
test registers.
The AGC (Automatic Gain Control) loop
ensures that the ADC operates inside its
dynamic range by using an analog/digital
feedback loop.
The RSSI register value RSSI.RSSI_VAL The RSSI register value RSSI.RSSI_VAL
can be referred to the power P at the RF is calculated and continuously updated for
pins by using the following equations: each symbol after RSSI has become valid.
SWRS041c Page 48 of 85
Not Recommended For New Designs
CC2420
60
40
0
-100 -80 -60 -40 -20 0
-20
-40
-60
RF Level [dBm]
SWRS041c Page 49 of 85
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CC2420
SWRS041c Page 50 of 85
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CC2420
31 0xA0FF 0 17.4
27 0xA0FB -1 16.5
23 0xA0F7 -3 15.2
19 0xA0F3 -5 13.9
15 0xA0EF -7 12.5
11 0xA0EB -10 11.2
7 0xA0E7 -15 9.9
3 0xA0E3 -25 8.5
Table 9. Output power settings and typical current consumption @ 2.45 GHz
29 Voltage Regulator
CC2420 includes a low drop-out voltage The regulated 1.8 V voltage output is
regulator. This is used to provide a 1.8 V available on the VREG_OUT pin. A
power supply to the CC2420 power simplified schematic of the voltage
supplies. The voltage regulator should not regulator is shown in Figure 28.
be used to provide power to other circuits
because of limited power sourcing The voltage regulator requires external
capability and noise considerations. components as described in the
Application Circuit section on page 19.
The voltage regulator input pin VREG_IN
is connected to the unregulated 2.1 to 3.6 When disabling the voltage regulator, note
V power supply. The voltage regulator is that register and RAM programming will be
enabled / disabled using the active high lost as leakage current reduces the output
voltage regulator enable pin VREG_EN. voltage on the VREG_OUT pin below 1.6 V.
SWRS041c Page 51 of 85
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CC2420
CC2420 should then be reset before the be left open. Note that the battery monitor
voltage regulator is disabled. will not work when the voltage regulator is
not used.
In applications where the internal voltage
regulator is not used, connect VREG_EN
and VREG_IN to ground. VREG_OUT shall
VREG_EN VREG_IN
Regulator
Enable / disable
Internal
bandgap 1.25 V
voltage
reference
VREG_OUT
30 Battery Monitor
SWRS041c Page 52 of 85
Not Recommended For New Designs
CC2420
BATTMON.BATTMON_EN VREG_IN
Internal
bandgap 1.25 V
voltage
BATTMON.BATTMON_OK
reference
BATTMON.BATTMON_VOLTAGE[4:0]
31 Crystal Oscillator
XOSC16_Q1 XOSC16_Q2
XTAL
C391 C381
Item CL= 16 pF
C381 27 pF
C391 27 pF
Table 10. Crystal oscillator component values
The RF input / output is differential (RF_N Component values are given in Table 2.
and RF_P). In addition there is supply Using a differential antenna, no balun is
switch output pin (TXRX_SWITCH) that required.
must have an external DC path to RF_N
and RF_P. If a single ended output is required (for a
single ended connector or a single ended
In RX mode the TXRX_SWITCH pin is at antenna), a balun should be used for
ground and will bias the LNA. In TX mode optimum performance.
the TXRX_SWITCH pin is at supply rail
voltage and will properly bias the internal The balun adds the signals from the RF_N
PA. and RF_P. This is achieved having two
paths with equal amplitude response, but
The RF output and DC bias can be done 180 degrees phase difference.
using different topologies. Some are
shown in Figure 4 and Figure 5.
SWRS041c Page 54 of 85
Not Recommended For New Designs
CC2420
CC2420 can be set into different transmit 0x1800 to the DACTST register and issue
test modes for performance evaluation. a STXON command strobe. The transmitter
The test mode descriptions in the following is then enabled while the transmitter I/Q
sections requires that the chip is first reset, DACs are overridden to static values. An
the crystal oscillator is enabled using the unmodulated carrier will then be available
SXOSCON command strobe and that the on the RF output pins.
crystal oscillator has stabilised.
A plot of the single carrier output spectrum
from CC2420 is shown in Figure 31 below.
33.1 Unmodulated carrier
An unmodulated carrier may be
transmitted by setting
MDMCTRL1.TX_MODE to 2 or 3, writing
-10
-20
-40
-50
-60
-70
-80
-90
-97
Center 2.45 GHz 200 kHz/ Span 2 MHz
SWRS041c Page 55 of 85
Not Recommended For New Designs
CC2420
sequence for bit error testing. Please note
33.2 Modulated spectrum
that CC2420 requires symbol
The CC2420 has a built-in test pattern synchronisation, not only bit
generator that can generate pseudo synchronisation, for correct reception.
random sequence using the CRC Packet error rate is therefore a better
generator. This is enabled by setting measurement for the true RF performance.
MDMCTRL1.TX_MODE to 3 and issues an
STXON command strobe. The modulated Another option to generate a modulated
spectrum is then available on the RF pins. spectrum is to fill the TXFIFO with pseudo-
The low byte of the CRC word is random data and set
transmitted and the CRC is updated with MDMCTRL1.TX_MODE to 2. CC2420 will
0xFF for each new byte. The length of the then transmit data from the FIFO
transmitted data sequence is 65535 bits. disregarding a TXFIFO underflow. The
The transmitted data-sequence is then: length of the transmitted data sequence is
then 1024 bits (128 bytes).
[Synchronisation header] [0x00, 0x78,
0xb8, 0x4b, 0x99, 0xc3, 0xe9, …] A plot of the modulated spectrum from
CC2420 is shown in Figure 32. Note that to
Since a synchronisation header (preamble find the output power from the modulated
and SFD) is transmitted in all TX modes, spectrum, the RBW must be set to 3 MHz
this test mode may also be used to or higher.
transmit a known pseudorandom bit
-10
-20
-30
1AVG 1SA
-40
-50
-60
-70
-80
-90
-100
Center 2.45 GHz 1 MHz/ Span 10 MHz
SWRS041c Page 56 of 85
Not Recommended For New Designs
CC2420
SRD regulations
34.3 Crystal accuracy and drift
International regulations and national laws A crystal accuracy of ±40 ppm is required
regulate the use of radio receivers and for compliance with IEEE 802.15.4 [1].
transmitters. SRDs (Short Range Devices) This accuracy must also take ageing and
for license free operation are allowed to temperature drift into consideration.
operate in the 2.4 GHz band worldwide.
The most important regulations are ETSI A crystal with low temperature drift and low
EN 300 328 and EN 300 440 (Europe), aging could be used without further
FCC CFR-47 part 15.247 and 15.249 compensation. A trimmer capacitor in the
(USA), and ARIB STD-T66 (Japan). crystal oscillator circuit (in parallel with C7)
could be used to set the initial frequency
accurately.
34.1 Frequency hopping and multi-
channel systems
For non-IEEE 802.15.4 systems, the
The 2.4 GHz band is shared by many robust demodulator in CC2420 allows up to
systems both in industrial, office and home 120 ppm total frequency offset between
environments. CC2420 uses direct the transmitter and receiver. This could
sequence spread spectrum (DSSS) as e.g. relax the accuracy requirement to 60
defined by [1] to spread the output power, ppm for each of the devices.
thereby making the communication link
more robust even in a noisy environment. Optionally in a star network topology, the
FFD could be equipped with a more
With CC2420 it is also possible to combine accurate crystal thereby relaxing the
both DSSS and FHSS (frequency hopping requirement on the RFD. This can make
spread spectrum) in a proprietary non- sense in systems where the RFDs ship in
IEEE 802.15.4 system. This is achieved by higher volumes than the FFDs.
reprogramming the operating frequency
(see the Frequency and Channel
34.4 Communication robustness
Programming section on page 50) before
enabling RX or TX. A frequency CC2420 provides very good adjacent,
synchronisation scheme must then be alternate and co channel rejection, image
implemented within the proprietary MAC frequency suppression and blocking
layer to make the transmitter and receiver properties. The CC2420 performance is
operate on the same RF channel. significantly better than the requirements
imposed by [1]. These are highly important
parameters for reliable operation in the 2.4
34.2 Data burst transmissions
GHz band, since an increasing number of
The data buffering in CC2420 lets the user devices/systems are using this license free
have a lower data rate link between the frequency band.
microcontroller and the RF device than the
RF bit rate of 250 kbps. This allows the
34.5 Communication security
microcontroller to buffer data at its own
speed, reducing the workload and timing The hardware encryption and
requirements. authentication operations in CC2420 enable
secure communication, which is required
The relatively high data rate of CC2420 for many applications. Security operations
also reduces the average power require a lot of data processing, which is
consumption compared to the 868 / 915 costly in an 8-bit microcontroller system.
MHz bands defined by [1], where only 20 / The hardware support within CC2420
40 kbps are available. CC2420 may be enables a high level of security even with
powered up a smaller portion of the time, a low-cost 8 bit controller.
so that the average power consumption is
reduced for a given amount of data to be
transferred.
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CC2420
34.6 Low-cost systems required to re-gain
synchronisation.
As the CC2420 provides 250 kbps multi-
channel performance without any external
In an IEEE 802.15.4 system, all
filters, a very low-cost system can be
communication is based on packets. The
made.
sensitivity limit specified by [1] is based on
Packet Error Rate (PER) measurements
A differential antenna will eliminate the instead of BER. This is a more accurate
need for a balun, and the DC biasing can measurement of the true RF performance
be achieved in the antenna topology. since it mirrors the way the actual system
operates.
34.7 Battery operated systems
It is recommended to perform PER
In low power applications, the CC2420 measurements instead of BER
should be powered down when not being measurements to evaluate the
active. Extremely low power consumption performance of IEEE 802.15.4 systems.
may be achieved when disabling also the To do PER measurements, the following
voltage regulator. This will require may be used as a guideline:
reprogramming of the register and RAM
configuration. A valid preamble, SFD and length
field must be used for each
34.8 BER / PER measurements packet.
CC2420 includes test modes where data is The PSDU (see Figure 17 on page
received infinitely and output to pins 36) length should be 20 bytes for
(RX_MODE 2, see page 40). This mode sensitivity measurements as
may be used for Bit Error Rate (BER) specified by [1].
measurements. However, the following
actions must be taken to do such a The sensitivity limit specified by [1]
measurement: is the RF level resulting in a 1%
PER. The packet sample space
A preamble and SFD sequence for a given measurement must
must be used, even if pseudo then be >> 100 to have a
random data is transmitted, since sufficiently large sample space.
receiving the DSSS modulated E.g. at least 1000 packets should
signal requires symbol be used to measure the sensitivity.
synchronisation, not bit
synchronisation like e.g. in 2FSK The data transmitted over air must
systems. The SYNCWORD may be be spread according to [1] and the
set to another value to fit to the description on page 24. Pre-
measurement setup if necessary. generated packets may be used,
although [1] requires that the PER
The data transmitted over air must is averaged over random PSDU
be spread according to [1] and the data.
description on page 24. This
means that the transmitter used The CC2420 receive FIFO may be
during measurements must be used to buffer data received
able to do spreading of the bit data during PER measurements, since
to chip data. Remember that the it is able to buffer up to 128 bytes.
chip sequence transmitted by the
test setup is not the same as the The MDMCTRL1.CORR_THR
bit sequence, which is output by
control register is by default set to
CC2420. 20, as described in the
Demodulator, Symbol
When operating at or below the Synchroniser and Data Decision
sensitivity limit, CC2420 may loose section.
symbol synchronisation in infinite
receive mode. A new SFD and
restart of the receiver may be
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CC2420
The RXCTRL1.RXBPF_LOCUR signal has the same phase shifts as the O-
control bit should be set to 1. QPSK sequence previously defined.
The simplest way of making a PER For a desired symbol sequence s0, s1, … ,
measurement will be to use another sn-1 of length n symbols, the desired chip
CC2420 as the reference transmitter. sequence c0, c1, c2, …, c32n-1 of length 32n
However, this makes it difficult to measure is found using table lookup from Table 3
the exact receiver performance. on page 24. It can be seen from comparing
the phase shifts of the O-QPSK signal with
Using a signal generator, this may either the frequency of a MSK signal that the
be set up as O-QPSK with half-sine MSK chip sequence is generated as:
shaping or as MSK. If using O-QPSK, the
phases must be selected according to [1]. (c0 xnor c1), (c1 xor c2), (c2 xnor c3), … ,
If using MSK, the chip sequence must be (c32n-1 xor c32n) where c32n may be
modified such that the modulated MSK arbitrarily selected.
In our reference design, the top layer is The external components should be as
used for signal routing, and the open areas small as possible (0402 is recommended)
are filled with metallisation connected to and surface mount devices must be used.
ground using several vias. Layer 2 has not
been used in our CC2420 reference Caution should be used when placing the
designs. Layer 3 is used for power routing microcontroller in order to avoid
and the bottom layer serves as ground interference with the RF circuitry.
plane with a little routing.
A Development Kit with a fully assembled
The area under the chip is used for Evaluation Module is available. It is
grounding and must be well connected to strongly advised that this reference layout
the ground plane with several vias. is followed very closely in order to get the
best performance.
The ground pins should be connected to
ground as close as possible to the The schematic, BOM and layout Gerber
package pin using individual vias. The de- files for the reference designs are all
coupling capacitors should also be placed available from the Texas Instruments
as close as possible to the supply pins and website.
connected to the ground plane by separate
36 Antenna Considerations
CC2420 can be used together with various Other commonly used antennas for short-
types of antennas. A differential antenna range communication are monopole,
like a dipole would be the easiest to helical and loop antennas. The single-
interface not needing a balun (balanced to ended monopole and helical would require
un-balanced transformation network). a balun network between the differential
output and the antenna.
The length of the /2-dipole antenna is
given by: Monopole antennas are resonant antennas
with a length corresponding to one quarter
L = 14250 / f of the electrical wavelength (/4). They are
very easy to design and can be
where f is in MHz, giving the length in cm. implemented simply as a “piece of wire” or
An antenna for 2450 MHz should be 5.8 even integrated into the PCB.
cm. Each arm is therefore 2.9 cm.
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CC2420
Helical antennas can be thought of as a
combination of a monopole and a loop
The length of the /4-monopole antenna is antenna. They are a good compromise in
given by: size critical applications. Helical antennas
tend to be more difficult to optimize than
L = 7125 / f the simple monopole.
where f is in MHz, giving the length in cm. Loop antennas are easy to integrate into
An antenna for 2450 MHz should be 2.9 the PCB, but are less effective due to
cm. difficult impedance matching because of
their very low radiation resistance.
Non-resonant monopole antennas shorter
than /4 can also be used, but at the For low power applications the differential
expense of range. In size and cost critical antenna is recommended giving the best
applications such an antenna may very range and because of its simplicity.
well be integrated into the PCB.
The antenna should be connected as
Enclosing the antenna in high dielectric close as possible to the IC. If the antenna
constant material reduces the overall size is located away from the RF pins the
of the antenna. Many vendors offer such antenna should be matched to the feeding
antennas intended for PCB mounting. transmission line (50 ).
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CC2420
37 Configuration Registers
The configuration of CC2420 is done by in Table 11. Many of these registers are
programming the 16-bit configuration for test purposes only, and need not be
registers. Complete descriptions of the accessed for normal operation of CC2420.
registers are given in the following tables.
After chip reset (from the RESETn pin or The FIFOs are accessed through two 8-bit
programmable through the MAIN.RESETn registers, TXFIFO and RXFIFO. The
configuration bit), all the registers have TXFIFO register is write only. Data may
default values as shown in the tables. still be read out of the TXFIFO through
regular RAM access (see section RAM
Note that the MAIN register is only reset by access section on page 29), but data is
using the pin reset RESETn. When writing then not removed from the FIFO. Note that
to this register, all bits will get the value the crystal oscillator must be active for all
written, not the default value. This also FIFO and RAM access.
means that the MAIN.RESETn bit must be
written both low and then high to perform a During address transfer, and while data is
chip reset through the serial interface. being written to the TXFIFO, a status byte
is returned on the serial data output pin
15 registers are Strobe Command SO. This status byte is described in Table
Registers, listed first in Table 11 below. 5 on page 29.
Accessing these registers will initiate the
change of an internal state or mode. There All configuration and status registers are
are 33 normal 16-bits registers, also listed described in the tables following Table 11.
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CC2420
Address Register Register type Description
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CC2420
MAIN (0x10) - Main Control Register
15 RESETn 1 R/W Active low reset of the entire circuit should be applied before
doing anything else. Equivalent to using the RESETn reset pin.
14 ENC_RESETn 1 R/W Active low reset of the encryption module. (Test purposes only)
13 DEMOD_RESETn 1 R/W Active low reset of the demodulator module. (Test purposes
only)
12 MOD_RESETn 1 R/W Active low reset of the modulator module. (Test purposes only)
11 FS_RESETn 1 R/W Active low reset of the frequency synthesizer module. (Test
purposes only)
10:1 - 0 W0 Reserved, write as 0
0 XOSC16M_BYPASS 0 R/W Bypasses the crystal oscillator and uses a buffered version of
the signal on Q1 directly. This can be used to apply an external
rail-rail clock signal to the Q1 pin.
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CC2420
MDMCTRL0 (0x11) - Modem Control Register 0
13 RESERVED_FRAME_MODE 0 R/W Mode for accepting reserved IEE 802.15.4 frame types when
address recognition is enabled (MDMCTRL0.ADR_DECODE = 1).
0 : Reserved frame types (100, 101, 110, 111) are rejected by
address recognition.
1 : Reserved frame types (100, 101, 110, 111) are always
accepted by address recognition. No further address decoding is
done.
When address recognition is disabled (MDMCTRL0.ADR_DECODE
= 0), all frames are received and RESERVED_FRAME_MODE is
don’t care.
12 PAN_COORDINATOR 0 R/W Should be set high when the device is a PAN Coordinator. Used
for filtering packets with no destination address, as specified in
section 7.5.6.2 in 802.15.4, D18
11 ADR_DECODE 1 R/W Hardware Address decode enable.
0 : Address decoding is disabled
1 : Address decoding is enabled
10:8 CCA_HYST[2:0] 2 R/W CCA Hysteresis in dB, values 0 through 7 dB
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CC2420
MDMCTRL1 (0x12)– Modem Control Register 1
10:6 CORR_THR[4:0] 20 R/W Demodulator correlator threshold value, required before SFD
search. Note that on early CC2420 versions the reset value was
0.
5 DEMOD_AVG_MODE 0 R/W Frequency offset average filter behaviour.
0 : Lock frequency offset filter after preamble match
1 : Continuously update frequency offset filter.
4 MODULATION_MODE 0 R/W Set one of two RF modulation modes for RX / TX
0 : IEEE 802.15.4 compliant mode
1 : Reversed phase, non-IEEE compliant (could be used to set
up a system which will not receive 802.15.4 packets)
3:2 TX_MODE[1:0] 0 R/W Set test modes for TX
0 : Buffered mode, use TXFIFO (normal operation)
1 : Serial mode, use transmit data on serial interface, infinite
transmission. For lab testing only.
2 : TXFIFO looping ignore underflow in TXFIFO and read cyclic,
infinite transmission. For lab testing only.
3 : Send random data from CRC, infinite transmission. For lab
testing only.
1:0 RX_MODE[1:0] 0 R/W Set test mode of RX
0 : Buffered mode, use RXFIFO (normal operation)
1 : Receive serial mode, output received data on pins. Infinite
RX. For lab testing only.
2 : RXFIFO looping ignore overflow in RXFIFO and write cyclic,
infinite reception. For lab testing only.
3 : Reserved
15:8 CCA_THR[7:0] -32 R/W Clear Channel Assessment threshold value, signed number on
2’s complement for comparison with the RSSI.
The unit is 1 dB, offset is the same as for RSSI_VAL. The CCA
signal goes active when the received signal is below this value.
The CCA signal is available on the CCA pin.
The reset value is approximately -77 dBm.
7:0 RSSI_VAL[7:0] -128 R RSSI estimate on a logarithmic scale, signed number on 2’s
complement.
Unit is 1 dB, offset is described in the RSSI / Energy Detection
section on page 48.
The RSSI_VAL value is averaged over 8 symbol periods. The
RSSI_VALID status bit may be checked to verify that the
receiver has been enabled for at least 8 symbol periods.
The reset value of –128 also indicates that the RSSI_VAL value
is invalid.
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CC2420
SYNCWORD (0x14) - Sync Word
15:0 SYNCWORD[15:0] 0xA70F R/W Synchronisation word. The SYNCWORD is processed from the
least significant nibble (F at reset) to the most significant
nibble (A at reset).
SYNCWORD is used both during modulation (where 0xF’s are
replaced with 0x0’s) and during demodulation (where 0xF’s are
not required for frame synchronisation). In reception an implicit
zero is required before the first symbol required by SYNCWORD.
The reset value is compliant with IEEE 802.15.4.
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CC2420
RXCTRL0 (0x16) – Receive control register 0
1:0 LOW_LNA_CURRENT[1:0] 1 R/W Controls main current in the LNA in AGC Low gain mode
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CC2420
RXCTRL1 (0x17) - Receive control register 1
10 MED_LOWGAIN 0 R/W LNA low gain mode setting in AGC medium gain mode.
9 HIGH_HGM 1 R/W RX Mixers high gain mode setting in AGC high gain mode.
8 MED_HGM 0 R/W RX Mixers high gain mode setting in AGC medium gain mode.
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CC2420
FSCTRL (0x18) - Frequency Synthesizer Control and Status
15:14 LOCK_THR[1:0] 1 R/W Number of consecutive reference clock periods with successful
synchronisation windows required to indicate lock:
0: 64
1: 128 (recommended)
2: 256
3: 512
13 CAL_DONE 0 R Calibration has been performed since the last time the
frequency synthesizer was turned on.
12 CAL_RUNNING 0 R Calibration status, '1' when calibration in progress and ‘0’
otherwise.
11 LOCK_LENGTH 0 R/W Synchronisation window pulse width:
0: 2 prescaler clock periods (recommended)
1: 4 prescaler clock periods
10 LOCK_STATUS 0 R Frequency synthesizer lock status:
0 : Frequency synthesizer is out of lock
1 : Frequency synthesizer is in lock
9:0 FREQ[9:0] 357 R/W Frequency control word, controlling the RF operating frequency
FC. In transmit mode, the local oscillator (LO) frequency equals
FC. In receive mode, the LO frequency is 2 MHz below FC.
(2405
MHz) FC = 2048 + FREQ[9:0] MHz
See the Frequency and Channel Programming section on page
50 for further information.
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CC2420
SECCTRL0 (0x19) - Security Control Register
9 RXFIFO_PROTECTION 1 R/W Protection enable of the RXFIFO, see description in the RXFIFO
overflow section on page 33. Should be cleared if MAC level
security is not used or is implemented outside CC2420.
8 SEC_CBC_HEAD 1 R/W Defines what to use for the first byte in CBC-MAC (does not
apply to CBC-MAC part of CCM):
0 : Use the first data byte as the first byte into CBC-MAC
1 : Use the length of the data to be authenticated (calculated as
(the packet length field – SEC_TXL – 2) for TX or using
SEC_RXL for RX) as the first byte into CBC-MAC (before the first
data byte).
This bit should be set high for CBC-MAC 802.15.4 inline
security.
7 SEC_SAKEYSEL 1 R/W Stand Alone Key select
0 : Key 0 is used
1 : Key 1 is used
6 SEC_TXKEYSEL 1 R/W TX Key select
0 : Key 0 is used
1 : Key 1 is used
5 SEC_RXKEYSEL 0 R/W RX Key select
0 : Key 0 is used
1 : Key 1 is used
4:2 SEC_M[2:0] 1 R/W Number of bytes in authentication field for CBC-MAC, encoded
as (M-2)/2
0 : Reserved
1:4
2:6
3:8
4 : 10
5 : 12
6 : 14
7 : 16
1:0 SEC_MODE[1:0] 0 R/W Security mode
0 : In-line security is disabled
1 : CBC-MAC
2 : CTR
3 : CCM
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CC2420
SECCTRL1 (0x1A) - Security Control Register
15 - 0 W0 Reserved, write as 0
14:8 SEC_TXL 0 R/W Multi-purpose length byte for TX in-line security operations:
CTR : Number of cleartext bytes between length byte and the
first byte to be encrypted
CBC/MAC : Number of cleartext bytes between length byte and
the first byte to be authenticated
CCM : l(a), defining the number of bytes to be authenticated but
not encrypted
Stand-alone : SEC_TXL has no effect
7 - 0 W0 Reserved, write as 0
6:0 SEC_RXL 0 R/W Multi-purpose length byte for RX in-line security operations:
CTR : Number of cleartext bytes between length byte and the
first byte to be decrypted
CBC/MAC : Number of cleartext bytes between length byte and
the first byte to be authenticated
CCM : l(a), defining the number of bytes to be authenticated but
not decrypted
Stand-alone : SEC_RXL has no effect
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CC2420
IOCFG0 (0x1C) – I/O Configuration Register 0
11 BCN_ACCEPT 0 R/W Accept all beacon frames when address recognition is enabled.
This bit should be set when the PAN identifier programmed into
CC2420 RAM is equal to 0xFFFF and cleared otherwise. This bit
is don't care when MDMCTRL0.ADR_DECODE = 0.
0 : Only accept beacons with a source PAN identifier which
matches the PAN identifier programmed into CC2420 RAM
1 : Accept all beacons regardless of the source PAN identifier
10 FIFO_POLARITY 0 R/W Polarity of the output signal FIFO.
0 : Polarity is active high
1 : Polarity is active low
9 FIFOP_POLARITY 0 R/W Polarity of the output signal FIFOP.
0 : Polarity is active high
1 : Polarity is active low
8 SFD_POLARITY 0 R/W Polarity of the SFD pin.
0 : Polarity is active high
1 : Polarity is active low
7 CCA_POLARITY 0 R/W Polarity of the CCA pin.
0 : Polarity is active high
1 : Polarity is active low
6:0 FIFOP_THR[6:0] 64 R/W FIFOP_THR sets the threshold in number of bytes in the
RXFIFO for FIFOP to go active.
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CC2420
IOCFG1 (0x1D) – I/O Configuration Register 1
15:12 PARTNUM[3:0] 2 R The device part number. CC2420 has part number 0x002.
11:0 MANFID[11:0] 0x33D R Gives the JEDEC manufacturer ID. The actual manufacturer ID
can be found in MANIFID[7:1], the number of continuation bytes
in MANFID[11:8] and MANFID[0]=1.
Chipcon's JEDEC manufacturer ID is 0x7F 0x7F 0x7F 0x9E
(0x1E preceded by three continuation bytes.)
15:13 TC_RXCHAIN2RX[2:0] 3 R/W The time in 5 us steps between the time the RX chain is enabled
and the demodulator and AGC is enabled. The RX chain is
started when the bandpass filter has been calibrated (after 6.5
symbol periods).
12:10 TC_SWITCH2TX[2:0] 6 R/W The time in advance the RXTX switch is set high, before
enabling TX. In s.
9:6 TC_PAON2TX[3:0] 10 R/W The time in advance the PA is powered up before enabling TX.
In s.
5:3 TC_TXEND2SWITCH[2:0] 2 R/W The time after the last chip in the packet is sent, and the TXRX
switch is disabled. In s.
2:0 TC_TXEND2PAOFF[2:0] 4 R/W The time after the last chip in the packet is sent, and the PA is
set in power-down. Also the time at which the modulator is
disabled. In s.
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CC2420
1
MANAND (0x21) - Manual signal AND override register
15 VGA_RESET_N 1 R/W The VGA_RESET_N signal is used to reset the peak detectors
in the VGA in the RX chain.
14 BIAS_PD 1 R/W Global bias power down (1)
7 XOSC16M_PD 1 R/W
6 RXBPF_CAL_PD 1 R/W Powerdown control of complex bandpass receive filter
calibration oscillator.
5 CHP_PD 1 R/W Powerdown control of charge pump.
1
For some important signals the value used by analog and digital modules can be overridden manually. This is done
as follows for the hypothetical important signal IS:
IS_USED = (IS * IS_AND_MASK) + IS_OR_MASK,
using boolean notation.
The AND-mask and OR-mask for the important signals listed resides in the MANAND and MANOR registers,
respectively.
Examples:
Writing 0xFFFE to MANAND and 0x0000 to MANOR will force LNAMIX_PD0 whereas all other signals will be
unaffected.
Writing 0xFFFF to MANAND and 0x0001 to MANOR will force LNAMIX_PD1 whereas all other signals will be
unaffected.
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CC2420
MANOR (0x22) - Manual signal OR override register
15 VGA_RESET_N 0 R/W The VGA_RESET_N signal is used to reset the peak detectors in
the VGA in the RX chain.
14 BIAS_PD 0 R/W Global Bias power down (1)
13 BALUN_CTRL 0 R/W The BALUN_CTRL signal controls whether the PA should receive
its required external biasing (1) or not (0) by controlling the
RX/TX output switch.
12 RXTX 0 R/W RXTX signal: controls whether the LO buffers (0) or PA buffers
(1) should be used.
11 PRE_PD 0 R/W Powerdown of prescaler.
7 XOSC16M_PD 0
6 RXBPF_CAL_PD 0 R/W Powerdown control of complex bandpass receive filter
calibration oscillator.
5 CHP_PD 0 R/W Powerdown control of charge pump.
11 VGA_GAIN_OE 0 R/W Use the VGA_GAIN value during RX instead of the AGC value.
10:4 VGA_GAIN [6:0] 0x7F R/W When written, VGA manual gain override value; when read, the
currently used VGA gain setting.
3:2 LNAMIX_GAINMODE_O 0 R/W LNA / Mixer Gain mode override setting
[1:0]
0 : Gain mode is set by AGC algorithm
1 : Gain mode is always low-gain
2 : Gain mode is always med-gain
3 : Gain mode is always high-gain
1:0 LNAMIX_GAINMODE 3 R Status bit, defining the currently selected gain mode selected by
[1:0] the AGC or overridden by the LNAMIX_GAINMODE_O setting.
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CC2420
15 - 0 W0 Reserved, write as 0
14 AGC_BLANK_MODE 0 R/W Set the VGA blanking mode when switching out a gain stage
When VGA_GAIN_OE = 0:
0 : Blanking is performed when the AGC algorithm switches
out one or more 14dB gain stages.
1 : Blanking is never performed.
When VGA_GAIN_OE = 1:
Blanking is performed when AGC_BLANK_MODE=1
13 PEAKDET_CUR_BOOST 0 R/W Doubles the bias current in the peak-detectors in-between the
VGA stages when set.
12:11 AGC_SETTLE_WAIT[1:0] 1 R/W Timing for AGC to wait for analog gain to settle.
10:8 AGC_PEAK_DET_MODE 0 R/W Sets the AGC mode for use of the VGA peak detectors:
[2:0]
Bit 2 : Digital ADC peak detector enable / disable
Bit 1 : Analog fixed stages peak detector enable /
disable
Bit 0 : Analog variable gain stage peak detector enable /
disable
7:6 AGC_WIN_SIZE[1:0] 1 R/W Window size for the accumulate and dump function in the
AGC.
0 : 8 samples
1 : 16 samples
2 : 32 samples
3 : 64 samples
5:0 AGC_REF[5:0] 20 R/W Target value for the AGC control loop, given in 2 dB steps.
Reset value corresponds to approximately 25% of the ADC
dynamic range in reception.
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CC2420
FSTST0 (0x27) - Frequency Synthesizer Test Register 0
11 VCO_ARRAY_SETTLE_LONG 0 R/W When '1' this control bit doubles the time allowed for VCO
settling during VCO calibration.
10 VCO_ARRAY_OE 0 R/W VCO array manual override enable.
4:0 VCO_ARRAY_RES[4:0] 16 R The VCO array result holds the register content of the most
recent calibration.
15 - 0 W0 Reserved, write as 0.
5:0 VCO_CURRENT_RES[5:0] 32 R The VCO current result holds the register content of the most
recent calibration.
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CC2420
FSTST3 (0x2A) - Frequency Synthesizer Test Register 3
15 CHP_CAL_DISABLE 1 R/W Disable charge pump during VCO calibration when set.
12 CHP_TEST_DN 0 R/W Forces the CHP to output "down" current when set
11 CHP_DISABLE 0 R/W Set to manually disable charge pump by masking the up and
down pulses from the phase-detector.
10 PD_DELAY 0 R/W Selects short or long reset delay in phase detector:
0: Short reset delay
1: Long reset delay
9:8 CHP_STEP_PERIOD[1:0] 2 R/W The charge pump current value step period:
0: 0.25 us
1: 0.5 us
2: 1 us
3: 4 us
7:4 STOP_CHP_CURRENT[3:0] 13 R/W The charge pump current to stop at after the current is stepped
down from START_CHP_CURRENT after VCO calibration is
complete. The current is stepped down periodically with intervals
as defined in CHP_STEP_PERIOD.
3:0 START_CHP_CURRENT[3:0] 13 R/W The charge pump current to start with after VCO calibration is
complete. The current is then stepped down periodically to the
value STOP_CHP_CURRENT with intervals as defined in
CHP_STEP_PERIOD.
Also used for overriding the charge pump current when
CHP_CURRENT_OE=’1’
15 - 0 W0 Reserved, write as 0.
5:0 FSM_CUR_STATE[5:0] 0 R Provides the current state of the FIFO and Frame Control
(FFCTRL) finite state machine. See the Radio control state
machine section on page 43 for details.
SWRS041c Page 78 of 85
Not Recommended For New Designs
CC2420
ADCTST (0x2D) - ADC Test Register
7 - 0 W0 Reserved, write as 0.
15 - 0 W0 Reserved, write as 0.
14:12 DAC_SRC[2:0] 0 R/W The TX DACs data source is selected by DAC_SRC according
to:
0: Normal operation (from modulator).
1: The DAC_I_O and DAC_Q_O override values below.-
2: From ADC, most significant bits
3: I/Q after digital down mixing and channel filtering.
4: Full-spectrum White Noise (from CRC)
5: From ADC, least significant bits
6: RSSI / Cordic Magnitude Output
7: HSSD module.
This feature will often require the DACs to be manually turned
on in MANOR and TOPTST.ATESTMOD_MODE=4.
11:6 DAC_I_O[5:0] 0 R/W I-branch DAC override value.
SWRS041c Page 79 of 85
Not Recommended For New Designs
CC2420
TOPTST (0x2F) - Top Level Test Register
RESERVED (0x30) - Reserved register containing spare control and status bits
7:0 TXFIFO[7:0] 0 W Transmit FIFO byte register, write only. Reading the TXFIFO is
only possible using RAM read. Note that the crystal oscillator
must be running for writing to the TXFIFO.
7:0 RXFIFO[7:0] 0 R/W Receive FIFO byte register, read / write. Note that the crystal
oscillator must be running for accessing the RXFIFO.
SWRS041c Page 80 of 85
Not Recommended For New Designs
CC2420
The two digital output pins CCA and SFD, IOCFG1.SFDMUX. This is summarized in
can be set up to output test signals defined Table 12 and Table 13 below.
by IOCFG1.CCAMUX and
SWRS041c Page 81 of 85
Not Recommended For New Designs
CC2420
SFDMUX Signal output on SFD pin Description
SWRS041c Page 82 of 85
Not Recommended For New Designs
CC2420
39 Soldering information
SWRS041c Page 83 of 85
Not Recommended For New Designs
CC2420
40 General Information
SWRS041c 2013-02-20 Changed packaging and orderable information to reflect change to RGZ package.
SWRS041b 2007-03-19 Slightly changed optimum load impedance on Page 9 and 19 to better describe the
Application circuit.
SWRS041c Page 84 of 85
Not Recommended For New Designs
CC2420
Revision Date Description/Changes
SWRS041c Page 85 of 85
PACKAGE OPTION ADDENDUM
www.ti.com 15-Apr-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
CC2420RGZR NRND VQFN RGZ 48 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 CC2420
& no Sb/Br)
CC2420RGZT NRND VQFN RGZ 48 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 CC2420
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 15-Apr-2017
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Feb-2019
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Feb-2019
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RGZ 48 VQFN - 1 mm max height
7 x 7, 0.5 mm pitch PLASTIC QUADFLAT PACK- NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224671/A
www.ti.com
PACKAGE OUTLINE
RGZ0048A VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
7.1 A
B 6.9
7.1
PIN 1 INDEX AREA 6.9
(0.1) TYP
1 MAX
C
SEATING PLANE
0.05 0.08 C
0.00
2X 5.5
2X SYMM
5.5
1 36
PIN1 ID 48X 0.30
0.18
48 37
(OPTIONAL)
SYMM 0.1 C A B
48X 0.5
0.3 0.05 C
4219044/B 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGZ0048A VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
2X (6.8)
( 5.15)
SYMM
48X (0.6) 48 35
48X (0.24)
44X (0.5) 1
34
2X SYMM 2X
(5.5) (6.8)
2X
(1.26)
2X
(1.065)
(R0.05)
TYP
23
12
21X (Ø0.2) VIA
TYP
13 22
2X (1.26) 2X (1.065)
2X (5.5)
LAND PATTERN EXAMPLE
SCALE: 15X
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGZ0048A VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
2X (6.8)
SYMM ( 1.06)
48X (0.6)
48X (0.24)
44X (0.5)
2X SYMM 2X
(5.5) 2X (6.8)
(0.63)
2X
(1.26)
(R0.05)
TYP
2X
2X (0.63)
(1.26)
2X (5.5)
EXPOSED PAD
67% PRINTED COVERAGE BY AREA
SCALE: 15X
4219044/B 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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