Internal Use Only

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COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM14I
MODEL: 23MB35PY
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL67715291 (1403-REV00) Printed in China

CONTENTS

CONTENTS .............................................................................................. 2

PRECAUTION............................................................................................3

SERVICING PRECAUTIONS.....................................................................4

SPECIFICATIONS......................................................................................6

TIMING CHART .......................................................................................11

ADJUSTMENT .........................................................................................14

BLOCK DIAGRAM...................................................................................18

TROUBLE SHOOTING ............................................................................19

EXPLODED VIEW .................................................................................. 22

SVC. SHEET ...............................................................................................

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-2- LGE Internal Use Only
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING

• There are some special components used in LCD monitor that BE CAREFUL ELECTRIC SHOCK !
are important for safety. These parts are marked on the
• If you want to replace with the new backlight (CCFL) or LIPS
schematic diagram and the Exploded View. It is essential
part, must disconnect the AC power because high voltage
that these critical parts should be replaced with the
appears at inverter circuit about 650Vrms.
manufacturer’s specified parts to prevent electric shock, fire or
other hazard.
• Handle with care wires or connectors of the inverter circuit. If
• Do not modify original design without obtaining written the wires are pressed cause short and may burn or take fire.
permission from manufacturer or you will void the original parts
Leakage Current Hot Check Circuit
and labor guarantee.
AC Volt-meter

TAKE CARE DURING HANDLING THE LCD MODULE WITH

Good Earth Ground
BACKLIGHT UNIT. such as WATER PIPE,
To Instrument's CONDUIT etc.
exposed 0.15uF
• Must mount the module using mounting holes arranged in four METALLIC PARTS
corners.
1.5 Kohm/10W
• Do not press on the panel, edge of the frame strongly or electric
shock as this will result in damage to the screen.
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1 Ω
• Do not scratch or press on the panel with any sharp objects,
*Base on Adjustment standard
such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the

electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded

through wrist band.

• Do not leave the module in high temperature and in areas of

high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the

module.

• If the surface of panel become dirty, please wipe it off with a

softmaterial. (Cleaning with a dirty or rough cloth may damage
the panel.)

CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-3- LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service 2. After removing an electrical assembly equipped with ES
manual and its supplements and addenda, read and follow the devices, place the assembly on a conductive surface such as
SAFETY PRECAUTIONS on page 3 of this publication. aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
NOTE: If unforeseen circumstances create conflict between the 3. Use only a grounded-tip soldering iron to solder or unsolder ES
following servicing precautions and any of the safety precautions on devices.
page 3 of this publication, always follow the safety precautions. 4. Use only an anti-static type solder removal device. Some solder
Remember: Safety First. removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
General Servicing Precautions 5. Do not use freon-propelled chemicals. These can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 6. Do not remove a replacement ES device from its protective
a. Removing or reinstalling any component, circuit board package until immediately before you are ready to install it.
module or any other receiver assembly. (Most replacement ES devices are packaged with leads
b. Disconnecting or re-connecting any receiver electrical plug or electrically shorted together by conductive foam, aluminum foil
other electrical connection. or comparable conductive material).
c. Connecting a test substitute in parallel with an electrolytic 7. Immediately before removing the protective material from the
capacitor in the receiver. leads of a replacement ES device, touch the protective material
CAUTION: A wrong part substitution or incorrect polarity to the chassis or circuit assembly into which the device will be
installation of electrolytic capacitors may result in an installed.
explosion hazard. CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
2. Test high voltage only by measuring it with an appropriate high 8. Minimize bodily motions when handling unpackaged
voltage meter or other voltage measuring device (DVM, replacement ES devices. (Otherwise harmless motion such as
FETVOM, etc) equipped with a suitable high voltage probe. the brushing together of your clothes fabric or the lifting of your
Do not test high voltage by "drawing an arc". foot from a carpeted floor can generate static electricity
3. Do not spray chemicals on or near this receiver or any of its sufficient to damage an ES device.)
assemblies.
4. Unless specified otherwise in this service manual, clean General Soldering Guidelines
electrical contacts only by applying the following mixture to the 1. Use a grounded-tip, low-wattage soldering iron and appropriate
contacts with a pipe cleaner, cotton-tipped stick or comparable tip size and shape that will maintain tip temperature within the
non-abrasive applicator; 10% (by volume) Acetone and 90% (by range or 500ºF to 600ºF.
volume) is opropyl alcohol (90%-99% strength) 2. Use an appropriate gauge of RMA resin-core solder composed
CAUTION: This is a flammable mixture. of 60 parts tin/40 parts lead.
Unless specified otherwise in this service manual, lubrication of 3. Keep the soldering iron tip clean and well tinned.
contacts in not required. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
5. Do not defeat any plug/socket B+ voltage interlocks with which bristle (0.5 inch, or 1.25cm) brush with a metal handle.
receivers covered by this service manual might be equipped. Do not use freon-propelled spray-on cleaners.
6. Do not apply AC power to this instrument and/or any of its 5. Use the following unsoldering technique
electrical assemblies unless all solid-state device heat sinks are a. Allow the soldering iron tip to reach normal temperature.
correctly installed. (500ºF to 600ºF)
7. Always connect the test receiver ground lead to the receiver b. Heat the component lead until the solder melts.
chassis ground before connecting the test receiver positive c. Quickly draw the melted solder with an anti-static, suction-
lead. type solder removal device or with solder braid.
Always remove the test receiver ground lead last. CAUTION: Work quickly to avoid overheating the circuit
8. Use with this receiver only the test fixtures specified in this board printed foil.
service manual. 6. Use the following soldering technique.
CAUTION: Do not connect the test fixture ground strap to any a. Allow the soldering iron tip to reach a normal temperature
heat sink in this receiver. (500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
Electrostatically Sensitive (ES) Devices the component lead until the solder melts.
Some semiconductor (solid-state) devices can be damaged easily c. Quickly move the soldering iron tip to the junction of the
by static electricity. Such components commonly are called component lead and the printed circuit foil, and hold it there
Electrostatically Sensitive (ES) Devices. Examples of typical ES only until the solder flows onto and around both the
devices are integrated circuits and some field-effect transistors and component lead and the foil.
semiconductor "chip" components. The following techniques CAUTION: Work quickly to avoid overheating the circuit
should be used to help reduce the incidence of component board printed foil.
damage caused by static by static electricity. d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-4- LGE Internal Use Only
IC Remove/Replacement Circuit Board Foil Repair
Some chassis circuit boards have slotted holes (oblong) through Excessive heat applied to the copper foil of any printed circuit
which the IC leads are inserted and then bent flat against the board will weaken the adhesive that bonds the foil to the circuit
circuit foil. When holes are the slotted type, the following technique board causing the foil to separate from or "lift-off" the board. The
should be used to remove and replace the IC. When working with following guidelines and procedures should be followed whenever
boards using the familiar round hole, use the standard technique this condition is encountered.
as outlined in paragraphs 5 and 6 above.
At IC Connections
Removal To repair a defective copper pattern at IC connections use the
1. Desolder and straighten each IC lead in one operation by gently following procedure to install a jumper wire on the copper pattern
prying up on the lead with the soldering iron tip as the solder side of the circuit board. (Use this technique only on IC
melts. connections).
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the 1. Carefully remove the damaged copper pattern with a sharp
IC. knife. (Remove only as much copper as absolutely necessary).
Replacement 2. carefully scratch away the solder resist and acrylic coating (if
1. Carefully insert the replacement IC in the circuit board. used) from the end of the remaining copper pattern.
2. Carefully bend each IC lead against the circuit foil pad and 3. Bend a small "U" in one end of a small gauge jumper wire and
solder it. carefully crimp it around the IC pin. Solder the IC connection.
3. Clean the soldered areas with a small wire-bristle brush. 4. Route the jumper wire along the path of the out-away copper
(It is not necessary to reapply acrylic coating to the areas). pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
"Small-Signal" Discrete TransistorRemoval/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Copyright © 2010 LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATIONS
1. General Specification

No Item Content Remark

1 Customer BRAND
2 User Model Name 23MB35PY
3 Sale region Refer to Suffix standard
4 Feature 23” Wide LCD MONITOR
5 Chassis Name LM14I
General External SW
Menu, reader, SES, auto, input, power
Scope &Adj.
6 Function OSD, Control lock, 1 Analog/1 DVI/1DisplayPort/1 Audio In
put, HDCP, USB Stream (1 Up /2 Down), speaker,
Super Energy Saving Picture Mode, Six Color

Power Cord Length : 1.87 M Length : 1.87 M

7 Shape : Wall-out Shape : Wall-out
Color : Black Color : Black

Length : 1.8m
Signal Cable Shape : Detachable Type Refer to Suffix
(D-SUB) Color : Black standard
Pin : Triple Row, 15 Pin D-Sub

Length : 2.0m
Shape : Detachable Type Refer to Suffix
DVI
Color : Black standard
8 Cable Pin : Triple Row, 18-Position DVI-D
Length : 1.5M
Audio Color: Black , Do not Support
Pin：2P

TV Length : ,Shape : ,Color: ,Pin Do not Support

Refer to Suffix
9 LIPS Input: AC100~240V 50~60Hz,1.0A Max
standard

P/No Specification

10 Applying module list Open cell: EAJ62447801 Open cell: LM230WF3-SJJ1

BLU: EBV60978044 BLU: LM23030030A
è lenti sheet (IPS)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-6- LGE Internal Use Only
2. Mechanical specification
No Item Content Remark
Width (W) Length (D) Height (H)
Before Packing 54.8 36.7 24.6 with Stand (cm)
Product （up height
1
Dimension 47.7）
54.8 33.5 16.8 Without Stand (cm)
After Packing Unit: cm
Product Only SET 4.5Kg Unit: kg
2
Weight With BOX Unit: kg
3 20ft 40ft
Container
Individual or
Loading Indi. Wooden Indi. Wooden

Quantity Palletizing
4 Stand Type Height stand
Assy Size (W x D x H) 25.1X25.1X24.6 Unit: cm
Tilt Degree -5~20°(±5°) Unit : degree
Tilt force 1.1kgf~3.5kgf
Swivel Degree 0 ~ 355°(±5°) Unit : degree
0.2kgf~3kgf
Pivot degree 0~90(±5) Unit : degree

5 Appearance General Refer to Standard of LG(56)G2-1011

3. Optical Character
3.1 Normal Mode
No Item Criteria Remark
1 Luminance(휘도) Average
120 (min)
Luminance Medium
(Full white pattern, 0.7V)
(cd/m2)
Average Warm
150(min),200 (Typ.)
Luminance Brightness:100
(Full white pattern, 0.7V)
(cd/m2) Contrast:100

Average
120(min)
Luminance Cool
(Full white pattern, 0.7V)
(cd/m2)
Luminance
75%(min),
Uniformity

2 Light Leakage Condition: Do not visible at 300 Lux

3.2 Reader Mode

Pattern Coordinate Minimum Normal Maximum

Wx 0.365
Typ-0.030 Typ+0.030 Reader 1
Wy 0.360
White
Wx 0.353
Typ-0.030 Typ+0.030 Reader 2
Wy 0.367

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-7- LGE Internal Use Only
4. Engineering Specification
1 Supported Sync. Type Separate Sync., Digital
Analog/ Horizontal 30 83kHz
2 Operating Frequency
Digital Vertical 56 75 Hz
3 Analog/ Max. 1920×1080 @ 60Hz
Resolution
Digital Recommend 1920×1080 @ 60Hz
4 Input Voltage Voltage :100 – 240 Vac, 50- 60HZ
5 Inrush Current Cold Start : 50 A Hot : 120 A
6 Sync
Operating Condition Video LED Wattage
(H/V)
white Test condition
(After 1.1920x1080@
On/On Active about 15s , 28W(Typ.)
60Hz
turn to Off) 2. burst pattern
On Mode
white
On/On (Super 3. 100~240V
(After about
Energy saving Active 15s , turn to 33W(max) 4. After aging
off) Off) 30mi
Off/On
white
Sleep Mode On/Off Off Blinking
0.3W under
Off/Off
Off Mode
- - Off 0.3W under
(Power switch off)
SES saving (low): -Test Condition
2w/h
7 Super Energys Saving Low/High/Off low white SES saving (high): (1)
4w/h
Typ:(Brightness:changed(to 200nits) contrast:100 24MB35PY:<23w/h
EPA6.0
8 Worst:(Brightness:100 contrast:100) 23MB35PY:<21 w/h
9 MTBF 50,000 HRS with 90% LED Life : 30,000 Hours(Min)
Confidence level
10 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)

11 Environm 0perating Temperature 10 °C ~ 35 °C

ent Humidity 10% ~ 80%
Condition Storage Temperature -20 °C ~ 60 °C
Humidity 5% ~ 90% non-condensing
BRIGHTNESS BRIGHTNESS (0 ~ 100)

ORIGINAL WIDE
RATIO ORIGINAL
Warm
COLOR MEDIUM
Preset
Temperature Custom
COOL
VOLUME VOLUME( 0 ~ 100)

CONTAST CONTAST(0 ~ 100)

Reader mode Custom/reader1/reader2

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-8- LGE Internal Use Only
17 Language
OSD MENU : English,
MENU (Monitor block) OTHERS LANGUAGE ▶ ENGLISH Germanic
French,
Spanish,
Italian,
Swedish,
Finnish,
Portuguese
Polish, Brazil,
Russian,
FACTORY RESET ▶ NO
Greek,
Chinese,
Japanese,
Korean.
Ukrainian,
Hindi
CHANNEL
2~69(AIR) / 1 ~ 125(CABLE) Function
MENU
CHANNEL Support:
(AV/TV block) ADD/DEL CH ADD/DELETE
No
AUTO CHANNEL ON/OFF
SELECT AIR/CABLE
FINE TUNE 0 ~ 100
CONTRAST 0~100
BRIGHTNESS 0~100 Function
ADJUSTME
SHARPNESS 0~100 Support:
NT
COLOR 0~100 No
TINT 0~100
VOLUME 0~100
BASS 0~100
Function
TREBLE 0~100
AUDIO Support:
MUTE ON/OFF
No
SOUND
MONO/STEREO
LANGUAGE▶
English/German/French/Esperanto
Function
Italian/Korean…
SETUP Support:
IMAGE SIZE ▶ FULL/1:1
No
OSD POSITION
TRANSPARENCY 0~100

Copyright © 2010 LG Electronics. Inc. All right reserved.

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-9- LGE Internal Use Only
5. Applying module Character
No Item Content Remark
Maker LGD
Type TFT
Active Display Area 23 inches(58.42cm) diagonal
Pixel Pitch [mm] 0.2 0.2652mm x 0.2652 mm.
Electrical Interface 2ch-LVDS
Color Depth 6-bit with A-FRC, 16.7M colors
526.184(H) x 303.416(V) x 1.3(D) mm
Size (Outline) [mm]
(Typ.)
LCD Module
Horizontal: 509.184mm
1 Feature
Active Display Area
Vertical: 286.416mm
Hard coating(3H), Anti-glare treatment of
Surface Treatment
the front polarizer
Operating Mode Transmissive mode, normally Black
Back light Unit White LED
Typical 14ms
R/T
Max. 25ms
CIE Color Minimum Normal Maximum
2 Coordinates
WX 0.283 Cool
(색 좌표) White Typ-0.03 Typ+0.03
WY 0.298 (9300K)
WX 0.301 Medium
Typ-0.03 Typ+0.03
WY 0.310 (8000K)
White
WX 0.313 Warm
Typ-0.03 Typ+0.03
WY 0.329 (6500K)
RX 0.651
Red
RY 0.338
GX 0.321 Warm
Green Typ-0.03 Typ+0.03
GY 0.614 (6500K)
BX 0.154
Blue
BY 0.063

5.1 Display Area

1) Active Display Area of the LCD Monitor Should be within Cabinet’s Bezel.
2) Distance Difference between Active Area and Bezel C
| A-B|<1.0 mm , | C-D|<1.0 mm
A: The Distance from The Left of Active Area to the Bezel Active area
B: The Distance from The Right of Active Area to the Bezel
A
C: The Distance from The Top of Active Area to the Bezel
D: The Distance from The Bottom of Active Area to the Bezel
A A B

Bezel

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
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6. EDID
6.1 23MB35PY

No Item Content 16진 Data

1 Manufacturer ID GSM 1E 6D
Analog: 23101
3D 5A
2 Product ID Digital: 23102 3E 5A
DP: 23117 4D 5A

3 Year 2013 17
4 Version 1 01
Analog : 3 03
5 Revision
Digital : 3 03
6 Serial Number * *
7 Week ** **
8 Model Name 23MB35 --
9 Check Sum **** ****
10 Special Item Need to Input Serial Number

** Protocol : DDC 2B

3.1.2 Data ( 128 Bytes )

3.1.2.1 EDID Ver. 1.3 FOR ANALOG ( 128Byte)

3.1.2.2 EDID Ver. 1.3 FOR DIGITAL (128Byte)

3.1.2.3 EDID Ver. 1.3 FOR DisplayPort (256Byte)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 11 - LGE Internal Use Only
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 - LGE Internal Use Only
TIMING CHART
(1) Signal(Video & Sync)

V id e o

B
C
S yn c

D E F
A

(2) H/V Timing

DOT Frequency Total Front Back
CLASSIF Polar Display Sync. Resolut
MODE CLOCK [kHz]/ Period Porch Porch
ICATION ity (A) (C) ion
[MHz] [Hz] (E) (D) (B)
H(Pixels) - 31.468 900 720 18 108 54 720 X
1 28.321
V(Lines) + 70.08 449 400 12 2 35 400
H(Pixels) - 31.469 800 640 16 96 48 640 x
2 25.175
V(Lines) - 59.94 525 480 10 2 33 480
3 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x
V(Lines) - 75 500 480 1 3 16 480
H(Pixels) + 37.879 1056 800 40 128 88 800 x
4 40.0
V(Lines) + 60.317 628 600 1 4 23 600
H(Pixels) + 46.875 1056 800 16 80 160 800 x
5 49.5
V(Lines) + 75.0 625 600 1 3 21 600
H(Pixels) - 48.363 1344 1024 24 136 160 1024 x
6 65.0
V(Lines) - 60.0 806 768 3 6 29 768
H(Pixels) + 60.023 1312 1024 16 96 176 1024 x
7 78.75
V(Lines) + 75.029 800 768 1 3 28 768
H(Pixels) + 108.0 67.500 1600 1152 64 128 256 1152 x
8
V(Lines) + 75.000 900 864 1 3 32 864
H(Pixels) + 63.981 1688 1280 48 112 248 1280 x
9 108.0
V(Lines) + 60.02 1066 1024 1 3 38 1024
H(Pixels) + 79.976 1688 1280 16 144 248 1280 x
10 135.0
V(Lines) + 75.035 1066 1024 1 3 38 1024
H(Pixels) - 65.290 2240 1680 104 176 280 1680 x
11 146.25
V(Lines) + 59.954 1089 1050 3 6 30 1050

H(Pixels) + 67.50 2200 1920 88 44 148 1920 x

12 148.50
V(Lines) + 60 1125 1080 4 5 36 1080

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TIMING CHART

DPI Video input

Factory support Horizontal Vertical
mode frequency frequency
(Preset Mode) (KHz) (Hz)
1 480P 31.5 60
2 576P 31.25 50
3 720P 37.5 50
4 720P 45 60
5 1080i 28.12 50
6 1080i 33.75 60
7 1080P 56.25 50
8 1080P 67.5 60

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- 12 - LGE Internal Use Only
ADJUSTMENT

1. Coverage PC audio volume : MAX

Apply to 58.4 cm (23 inch) Wide monitor made in Monitor Factory * LAN cable
Gumi Korea) or made in accordance with the standard of Gumi * Router
Factory process. * PC: vSpace S/W for N+ ( Ver 4.5.xx.xx ) --- Caution: Ver
4.4.xx.xx for N1742L family

2. Appointment 3.2.2 Total Assembly Line

· Ready : Heat-run during5 minutes in the state with signal
2.1 Adjustment must be done as fixed sequence, and adjustment · Connect input signal to D-sub.
sequence can be modified after agreement withthe responsible · Default value before adjustment : Contrast “70” , Brightness
R&D engineer considering mass-production condition. ‘100(Max)”
2.2 Power : AC 100 - 240 Voltage (Free)
2.3 Input signal: 3.2.3 Adjustment of Horizontal/Verticality screen
2.3.1 RGB Input: As Product Standard (Signal ROM : LB800K position, Clock and Clock Phase at each Mode.
Ver1.6) · There is no special factory mode adjustment. Writing initial value
2.3.2 RJ-45 input : As Product Standard (Ethernet connection of EEPROM in Board Assembly line is adjusting Preset Mode
through network from Host PC) and Reset mode. (EEPROM is initialized when AC Power is
* PC spec for MK(Minikey) Loader (TBD): CPU - Dual core 2.0 ON first.)
GHzD, Memory - 2 GByteD · If the change of FOS data is needed after M.P, it is possible by
*PC spec for Host PC (TBD): CPU - Dual core 2.0 GHzD, writing Mode Data with EEPROM write command or modifying
Memory - 2 GByteD the Mode Data in MICOM itself.
2.4 Warm-up Time: Over than 30 minutes
2.5 Adjustment equipment : White balance equipment (CA-110), 3.2.4 Color coordinates adjustment and Luminance
Display adjust equipment, VG-813(or VG819), Oscilloscope, adjustment.
PC (More than 486 computer ) & White balance adjust 3.2.4.1 Color coordinates adjustment
program. · Monitor Contrast / Brightness
- Contrast : 70
- Brightness : 100(Max)
3. Adjustment · CA-110: Set “channel 9”
· Signal Generator : At cut-off and drive --> 16 step pattern for
3.1 Overview ADC (Program No.: 31)
Use factory automation equipment and adjust automatic - Output Voltage : 700 mVp-p
movement. But, do via passivity adjust in erroroccurrence. - Output Mode : Mode 12 (SXGA 60 Hz)mode Setting.

3.2 Adjustment order 3.2.4.2.Adjustment : Board Assembly Line

(refer to the Adjustment standard and adjustment command table) · Select RGB mode
· Input 16 step pattern for ADC (Program No.31 (Mode 12,Pattern
3.2.1 Board Assembly Line 11)). (Video level : 700 mVp-p)
3.2.1.1 15pin D-sub (RGB) · Adjust by commanding AUTO_COLOR_ADJUST
· Connect input signal to 15pin D-sub. · Confirm “Success” message in Screen or Check the data of
· Check the firmware version & model name. And write the 0xFE, 0xFF address of EEPROM(0XA6) is 0xAA after waiting 5
firmware code to the serial Flash ROM by ISP. seconds.
· Ready for adjustment : check whether adjustment command · If there is “FAULT” message or the data of 0xFE, 0XFF address
works normally or not and the operating state of each mode. of EEPROM(0xA6) is not 0xAA, do adjust again.
· Check the display state of gray color when 256 gray scale · If all Adjustment is completed, the values of 6500K, User Color
patterns is embodied. and 9300K are saved automatically.
· Read by EEPROM Read Command to check whether initial · Select RGB mode
value is correct or not. · Input 16 step pattern for ADC (Program No.31 (Mode 12,Pattern
3.2.1.2 MK( Minikey ) Loading 11)). (Video level : 700mVp-p)
· Open MK Loader Tool on MK Loader PC. · Adjust by commanding AUTO_COLOR_ADJUST
( * MK Loader PC should be connected Internet) · Confirm “Success” message in Screen or Check the data of
· Connect input signal to RJ-45 input with LAN cable connected 0xFE,0xFF address of EEPROM(0xA6) is 0xAA after waiting 5
network devices such as routers. seconds.
· Turn on the Monitor set.
· Click the box when the °∞empty port °∞box is changed to “write 3.2.4.3. Confirm at Total Assembly Line: adjustment
mini-key” in MK Loader Tool. · Check the data of 0xFE, 0xFF address of EEPROM(0xA6) is
0xAA.
3.2.1.2 RJ-45 input · If the data of 0XFE, FF address of EEPROM(0xA6) is not
· Connect input signal to RJ-45 input with LAN cable connected 0xAA, do adjust again by 3.2.4.2.
network devices such as routers.
· Check USB 1.1 Port (Keyboard/ Mouse) : @RJ-45 input
· Check USB 2.0 Port (USB Memory Stick 2port) : @RJ-45 input
· Check Audio (Ear-phone out/ Mic in/ Speaker) : @RJ-45 input,

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 14 - LGE Internal Use Only
3.2.4.4. Confirm PRESET 6500K Color coordinates and Adjust when there is Process change or Adjustment setting change.
PRESET 9300K Color coordinates .
· Set as Aging mode ON, by commanding AGING_ON/OFF 3.2.5.5. OSD & Adjustment device Confirmation : Confirm
command code. operation mentioned as product spec.
· Select Module that is being used in present production by · Vary Brightness and Contrast and confirm the variation of
commanding MODULE SELECT. ( It is not needed so far. Luminance and display status.
However, it will be needed to apply other modules) · Operate the f-engine function and confirm variation of Luminance.
· Send SYSTEM RESET command to set Module data. · Make sure to do FACTORY RESET after confirmation of OSD
· Input Full White Pattern (Video level : 700 mVp-p) function.
· Set as 9300K by commanding COLOR_MODE_CHANGE
Command code. 3.2.5.6. Confirm the display state by inputting 8 color Bar Pattern &
· Check to meet x = 0.283 ± 0.03, y=0.298 ± 0.03, and confirm. 256 Gray Scale pattern.
· Only if it does not meet, adjust as below steps.
· Adjust to meet x = 0.283 ± 0.01, y=0.298 ± 0.01 in 5 minutes. and 3.2.5.7. DPM operation confirmation : Check if Power LED Color
confirm. and Power Consumption operates as standard.
· Save 9300K Color by commanding COLOR SAVE Command · Measurement Condition : 230 V@ 50 Hz (Analog)
code. · Confirm DPM operation at the state of screen without Video
· Set as 6500K by commanding COLOR_MODE_CHANGE Signal.
Command code.
· Check to meet x = 0.313 ± 0.03, y=0.329 ± 0.03, and confirm. 3.2.5.8. RJ-45 input
· Only if it does not meet, adjust as below steps. · Connect input signal to RJ-45 input with LAN cable connected
· Adjust to meet x = 0.313 ± 0.01, y =0.329 ± 0.01, and confirm. network devices such as routers.
· Save 6500K Color by commanding COLOR SAVE Command · Check USB 1.1 Port (Keyboard/ Mouse) : @RJ-45 input
code. · Check USB 2.0 Port (USB Memory Stick 2port) : @RJ-45 input
· Set as sRGB by commanding COLOR_MODE_CHANGE · Check Audio (Ear-phone out/Mic in/Speaker) : @RJ-45 input, PC
Command code. audio volume : MAX
· Adjust to meet Y = 150 ± 50, and confirm. * LAN cable
· Save sRGB Color by commanding COLOR SAVE Command * Router
code. * PC: vSpace S/W for N+ ( Ver 4.5.xx.xx ) --- Caution: Ver
3.2.4.5. Confirm User color coordinates . 4.4.xx.xx for N1742L family
· Confirm Whether User color is saved same as 6500K.
· After confirming Color coordinates, Must return to 6500K 3.2.5.9. DDC EDID Write
( Set as Aging mode ON, by commanding AGING_ON/OFF
3.2.5 Confirm Operation state. command code. )
3.2.5.1 Operation mode : Confirm whether each appointed mode 1) SUFFIX: xxxxxPN
operate correctly or not. · Connect analog Signal Cable to D-sub wafer.
3.2.5.2 Confirmation of Adjustment condition and operation : · Write EDID DATA to EEPROM(24C08) by using DDC2AB
Confirm whether it meet Auto/Manual equipment Adjustment protocol.
standard or not. · Check whether written EDID data is correct or not.
· Confirm Analog screen state : Confirm screen state at below (refer to Product spec).
mode. --> After writing EDID, send Elapsed Time Clear command.
Appointment mode (RGB input): (Elapsed time should not be displayed, after EDID writing)
640*480 @60Hz (Mode 1), : Confirm periodically (in the first set of new lot, process change)
800*600@75Hz(Mode 5), whether module name and aging time disappeared on the self-
1024*768@60Hz(Mode 8), diagnostics OSD with signal cable disconnected.
1280*1024@60Hz(Mode 12), --> If Elapsed Time Clear command isn°Øt executed, module
SMPTE pattern(Check 0%,5%,95%,100%) name, aging time and TCO word appear on the self-diagnostics
–Mode can be added. OSD.(Module name and aging time should not appear after
writing EDID)
3.2.5.3. Confirm Auto adjustment operation. --> Make sure to do FACTORY RESET at the final process.
· Input Analog 1 Dot on/off & Rectangle Pattern at Mode
12(1280x1024@60 Hz) 3.2.5.10. Shipping condition
· Confirm adjustment operation by changing Clock, Phase, H/V · Contrast : 70
Position. · Power Switch : Off
· Check Clock, Phase by pressing AUTO Key. · Brightness : “100(Max)”
· Confirm first set of new lot by periods · Color Select : Preset ( 6500K )
· Language Select : Refer to product spec.
3.2.5.4 Other quality · OSD Position : Center
· Confirm that each items satisfy under standard condition that was · Power indicator : ON
written product spec. · Flatron f-engine : Normal
· Confirm Applying Module & MICOM Setting --> Confirm with
Service OSD
- Confirm at Service OSD by “Menu + Power key” on .(from
Power off)
- Confirm first set of new lot by periods, and confirm periodically
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 - LGE Internal Use Only
4.Standard of Auto/Manual equipment adjustment

“Changeable by Suffix ”
No Category Class(Type) Rule Remark
Safety UL UL60950-1 YES
CSA (cUL) CSA C22.2 No.60950-1-03 YES
1 TUV-GS(TUV-Type) EN60950-1 TUV-GS(YES)

TUV-Type（NO）

SEMKO EN60950-1 NO
EMC FCC CLASS B FCC 47 CFR Part 15 Class B YES
2
CE EN55022B, EN55024, EN61000-3-2, 3 YES
X-Ray DHHS DHHS Rule 21 CFR Subchapter J N/A
3
(CRT only) HWC HWC Radiation Emitting Device ACT N/A
Low MPR II MPR 1990:8; MPR 1990::01
4 NO
Radiation
TCO TCO 6.0 Emission, Ergonomics, Ecology, Energy
5 YES
saving
Ergonomics ISO9241 (CRT) ISO9241-3, 7, 8 NO
6
ISO9241-307 (LCD) ISO13406-2,ISO9241-307 NO
Etc KC(SAFETY) Electric Supplies Safety Rule
(Korea) (K60950) NEED

7
KC(EMC) MIC Ordinance 825
MIC Notice 100,Class B, NEED
Electric Article Technical Standard Ⅲ
CCC GB4943, GB9254, GB17625.1 YES
8 Etc
(China)

Test Hi-Pot 1500 V ac or 2121Vdc, 1 sec, under 10mA NO

9
Earth Continuity 25 A, 1 sec, under 0.1 ohm NO
10 EPA 6.0 EnergyStar 6.0 Energy Star Display Version 6.0 YES
11 EPEAT(gold) YES

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 16 - LGE Internal Use Only
5. Pattern for Adjustment
Pattern 0 : FULL BLACK (State of without video signal )
Pattern 1 : FULL WHITE (Don’t display other Character except for White Pattern)
Pattern 3 : FULL WHITE
Pattern 4 : Cross hatch pattern (Horizontal 10Line, Vertcial 8Line) & Rectangle Pattern
Pattern 5 : 1 Dot on, 1 Dot off & Rectangle Pattern
Pattern 6 : Vertical Sync only input (Use signal cable of which Pin #5 is GND)
Pattern 7 : Horizontal Sync only input (Use signal cable of which Pin #5 is GND)
Pattern 8 : State of without Vertical/Horizontal Sync and Video Signal. (Use signal cable of which Pin #5 is GND)
Pattern 9 : 8 Color Bar Pattern + 16 Gray Level Pattern
Pattern 10 : SMPTE Pattern
Pattern 11 : 16 Gray Step Pattern (700mV)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 14 - LGE Internal Use Only
BLOCK DIAGRAM (Main)

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 15 - LGE Internal Use Only
No power issue

NO
Check P200 PIN 1-3 CHECK LIPS

Only for training and service purposes

YES

NO
Is IC105 CHECK IC105
PIN2(19V),PIN3(5V)

Copyright © 2010 LG Electronics. Inc. All right reserved.

YES

NO
Is IC202 PIN2(3.3V) CHECK IC202

- 16 -
YES
1. NO POWER

NO
Is IC100 PIN49 `
CHECK CRYSTAL X100
PULSE

CHECK IC100
TROUBLESHOOTING GUIDE

IC102-#2 IC102-#3 IC103-#2 X100

LGE Internal Use Only

No Raster(OSD is not displayed)

Only for training and service purposes

Check IC100 NO
PIN2(3.3V) CHECK IC202 PIN1(3.3V)
PIN73(1.2V)

Copyright © 2010 LG Electronics. Inc. All right reserved.

YES
IC100 PIN48,49 NO 1.CHECK X100
14.318MHz 2check. Trouble in IC100

YES

- 17 -
CHECK IC100
PIN22(H- NO CHECK IC100
SYNC),PIN21(V-
SYNC)

YES
CHECK CONNECTION From DSUB TO
Is IC100 PIN49 NO IC100
PULSE
2. NO RASTER (OSD IS NOT DISPLAYED) – MAIN

Trouble in cable or LCD module

LGE Internal Use Only

3. TROUBLE IN DPM

CHECK PC. PC is going to the DPM

CHECK H/V SYNC LINE

mode

NO
NO
Check R209 AND R210

YES

YES
IC100 PIN21,22
Trouble in DPM

Trouble in IC100

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes
- 18 - LGE Internal Use Only
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

920

910
400

410
450
460
200

330
300
PCB P/N: EAX65587001_1.0 (LM14I) 3.3V_VDD 1.2V_VDD
4M Serial Flash
Date : 2013.07.24
READY
C126

GPIO/PWM1/SD2/SPDIF2/DVI_CTRL_OUT2/IICSCL/IICSCL_AUX
C107 C108 C117 C124 C125 3.3V_VDD
C110 C112 0.1uF 0.1uF
0.1uF 0.1uF 4.7uF 16V 0.1uF 0.1uF
16V 16V 0.1uF 0.1uF 10V 16V
C123 16V 16V
16V 16V
READY IC102
R130 R131 W25X40CLSNIG C133
4.7K 4.7K 0.1uF
16V
CS VCC
1 8
SPI_/CS
R127
56 DO[IO1] HOLD R135
2 7
SPI_DO
1/16W 10K
R128
1% R137
56 WP CLK 56

GPIO/IRQB/SDI/SPDIF1/IICSDA/IICSDA_AUX
3 6 SPI_CLK

WP_Flash
12V_LIPS WP_Flash
AUX_CHP

AUX_CHN

WLED_EN
P_LED_1
MP2315
DVI_SDA

DVI_SCL

SPI_/CS

SPI_CLK

1/16W 1/16W
DP_HPD
R132 R253
SPI_DO

SPI_DI

R256 3.3V_VDD 1% GND DI[IO0] 1%

56

A_DIM
100K 4.7K 4 5
SPI_DI

MUTE
GPIO/PWM0/PWM1/TCON[14]/SPDIF2/CEC

1/16W
C1321%
22pF
MP2315
50V
IC104 3.3V_VDD READY
MP2315GJ
MP2315 DC_FB C113 R114
R148 4.7uF 10K C118
JP-GND2

JP-GND3

JP-GND4

47K AAM FB 0.1uF

JP-GND1

1 8 10V
56

GPIO/SD2/SCK/SPDIF2/AUX_D2

GPIO/SD0/SPDIF0/AUX_TXDATA
16V
56

GPIO/PWM2/INT0/SCK/AUX_D1
READY

GPIO/PWM4/SD3/MCK/SPDIF3
IN VCC
R143

2 7 C115
R255

MP2315 0.1uF R115

MP2315 DC_OUT
DDCSCL2/GPIO/AUX_CH_P0
DDCSDA2/GPIO/AUX_CH_N0
DDCSDA3/GPIO/AUX_CH_N1
DDCSCL3/GPIO/AUX_CH_P1

MP2315 C186 16V 10K

C162 C163 SW EN/SYNC 0.1uF

GPIO/T1/SD1/WS/SPDIF1
10uF 0.1uF 3 6 MP2315 25V
25V C109 GPO/PWM5/SPDIF1/PWM1

GPIO/CLKO/MCK/AUX_OE
25V
GND
3A MP2315
BST
R149
68K
1.2V_VDD 3.3V_VDD 22pF
C111
22pF

GPIO/T0/SD0/SPDIF0
4 5 50V 50V
X100
R150 14.31818MHz
68

GPIO/INT1/WS/SD1
MP2315
L102-*1 MP2315
10uH C164
0.1uF

SPI_SCLK/SDIO
50V
R112
1M

SI/MCU_SCLK
READY

CEB/IRQB
3.3V_VDD

SO/SCSB
RESETB

VCCK_3

PGND_3
PVCC_3
main to PSU Control KEY
[EP]
XI
R101 XO
6.2K
R100
Multi Option Tact control 6.2K
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
P102
Tact control
C185-*1
0.1uF

Tact control
C187-*1
0.1uF
12V to 5V DC/DC READY
DP_VDD/TMDS_VDD_1 1 102 GPIO/PWM0/SD3/SPDIF3
VOLUME
SMW200-12 16V 16V
12V_LIPS TMDS_REXT 2 101 GPIO/PWM5/DHS/DVS/DENA/DCLK
JP105 THERMAL
R197 LANE0P/RX2P_0 3 129 100 GPIO/PWM4/DHS/DVS/DENA/DCLK
12V 1 100K DP_3N
5VS 3.3V_VDD L101
UBW2012-121F
TPS5433 LANE0N/RX2N_0 4 99 GPIO/PWM3/TXE0-_10B
IC105 DP_3P
12V 2
Control PWR 5V Control PWR 3.3V TPS54339EDDAR[EP]GND LANE1P/RX1P_0 5 98 GPIO/PWM2/TXE0+_10B
R133 R134 DP_2N
C158
12V 3 0 0 C127
LANE1N/RX1N_0 GPIO/PWM1/TXE1-_10B
R195
R196
4.7uF 4.7uF VBST
1 8
SS
DP_2P 6 97
4.7K 25V 25V
LANE2P/RX0P_0 GPIO/PWM0/TXE1+_10B
THERMAL

4.7K READY
GND
4 KEY1 Close to IC VIN EN TPS5433 DP_1N 7 96
9

2 7
MENU SES EXIT C192
LANE2N/RX0N_0 TXE0-_8B/TXE2-_10B
5
C188
TPS5433
C170
8200pF
DP_1P 8 95 Y0M-B
GND KEY0 TPS5433 SW VREG5 25V
20V

20V

4.7uF
C185 C187
POWER AUTO INPUT 25V
0.1uF
25V C190
3 6 LANE3P/RXCP_0 9 94 TXE0+_8B/TXE2+_10B
68pF 0.1uF DP_0N Y0P-B
TPS5433

68pF 5VS
R198

6
GND
JP101 50V 16V GND VFB LANE3N/RXCN_0 10 93 TXE1-_8B/TXEC-_10B
0

50V 4 5
Touch control
Touch control
DC_OUT
3A DP_0P Y1M-B
KEY1 7 3.3V_VDD
TPS5433
L102 DP_GND/TMDS_GND 11 IC100 92 TXE1+_8B/TXEC+_10B
READY

JP102 4.7uH Y1P-B

VA101

VA102
READY

8
R258 Large thermal PAD on bottom side LANE0P/RX2P_1 12 91 TXE2-_8B/TXE3-_10B
KEY0 4.7K DVI0- Y2M-B
JP103 C146
READY TPS5433 15pF LANE0N/RX2N_1 TXE2+_8B/TXE3+_10B
P-LED1
9
R297
C R257
READY
C159 C181 C182
READY
C183

R192
100K
50V
TPS5433 DC_FB
C191
0.47uF DVI0+
LANE1P/RX1P_1
13
RTD2486VTD-CG 90
TXEC-_8B/TXE4-_10B
Y2P-B
0

16V
Q100 B
4.7K 10uF 10uF 10uF 10uF R194
0 TPS5433
DVI1-
14 89 CLKOUTM-B
10 MMBT3906(NXP) 10V 10V 10V 10V
P-LED2
JP106 R199
P_LED_1 1/10W
LANE1N/RX1N_1 15 88 TXEC+_8B/TXE4+_10B CLKOUTP-B
E 4.7K TPS5433 DVI1+
TPS5433
LANE2P/RX0P_1 TXE3-_8B/TXO0-_10B
20V

11 READY R193
GND
JP104 C189 MMBT3904-(F) 18K
DVI2-
16 87 Y3M-B
READY

0.1uF Q100-*1
12 16V
5VS
C
LANE2N/RX0N_1 17 86 TXE3+_8B/TXO0+_10B
3.3V READY 2-ch LDO L203 DVI2+ Y3P-B
For EAX64604804 TYPE B BLM18PG121SN1D
LANE3P/RXCP_1 PGND_2
R298

0 R299 18 85
VA103

3.3V_VDD DVIC+
0 E
For EAX64674804 TYPE
IC202
READY
C230
0.1uF
LANE3N/RXCN_1 19 84 PVCC_2
APE8839AMP-C [EP]GND 16V DVIC-
C229 C235 ADC_VDD33 GPIO/TXO0-_8B/TXO1-_10B
1uF 4.7uF 20 83 Y0M-A
VOUT1 EN1 10V 10V
L100 3.3V_VDD 1 8 3.3V_DP
R254 AVS0 21 82 GPIO/TXO0+_8B/TXO1+_10B
L202 C231 VSYNC Y0P-A
THERMAL

BLM18PG121SN1D BLM18PG121SN1D0.1uF 56
VIN1 GND_1
R140 AHS0 22 81 GPIO/TXO1-_8B/TXO2-_10B
9

2 7 16V
HSYNC Y1M-A
L110 5VS 56
BLM18PG121SN1D VOUT2 GND_2
ADC_VDD 23 80 GPIO/TXO1+_8B/TXO2+_10B
3 6 Y1P-A
R259
R102 100 C100 0.047uF B0- 24 79 GPIO/TXO2-_8B/IIS_WS/SPDIF3/TXOC-_10B
Y2M-A
VA100

C184 READY 5.6 VIN2 EN2

20V

4 5
B0+ GPIO/TXO2+_8B/IIS_SCK/SPDIF2/TX0C+_10B
ADUC 5S 02 0R5L

0.1uF ZD100 R103 56 C101 0.047uF

16V 5.6B 1.2V_VDD
BLUE 25 78 Y2P-A
0.6A Each
READY

R104 100 C102 0.047uF G0- 26 77 GPIO/TXOC-_8B/TXO3-_10B

ZD200

C232 CLKOUTM-A
5.5V

130724
READY

1uF
Main IC EOS protection READY
10V Large thermal PAD on bottom side R105 56 C103 0.047uF G0+ 27 76 GPIO/TXOC+_8B/TXO3+_10B
1.2V_VDD

GREEN CLKOUTP-A
R106 470 C104 0.047uF SOG0 28 75 GPIO/TXO3-_8B/IIS_MCK/SPDIF1/TXO4-_10B
READY
C234 Y3M-A
C233 4.7uF R107 C105 0.047uF R0- GPIO/TXO3+_8B/IIS_SD0/SPDIF0/TXO4+_10B
1uF 10V 29 74 Y3P-A
10V 100
C106 0.047uF R0+ 30 73 VCCK_2
RED
R108 R110 GPIO_1 31 72 GPIO/PWM3
DSUB_DET 56 PWM_DIM
1K
R111 GPIO_2 32 71 SPDIF3/SD3/GPIO/PWM1/PWM5
DVI_DET
1K
R109 GPIO_3 33 70 GPIO/PWM4/SPDIF2/SD2/IICSDA
DP_DET
1K
GPIO_4 34 69 GPIO/PWM2/SPDIF1/SD1/IICSCL JP133
130718
LED DRIVER IC ESD protection
56->1K
GPIO_5 35 68 GPIO/PWM0/SPDIF0/SD0 3.3V_VDD
LVDS OUT
PanelOPT(ITLC)
GPIO_6 36 67 GPIO/MCK R240 PanelOPT(ITLC)
12V_LIPS 4.7K 31
R238
GPIO_7 37 66 GPIO/CLKO/SCK 100
30
R116 L103 D100 Y0M-B JP123
ITLC
1K 33UH SK510B_TSC ADC_GND 38 65 GPIO/PWM1/T2EX/WS/ Y0P-B JP107 29
WLED_EN
R117 C173 100V Y1M-B 28
JP108

39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
100K 1000pF C175 READY
Y1P-B 27
50V 4.7uF JP109
25V D101 BAT54
IC103 D Q102 Y2M-B JP110 26
DT1641S [EP]GND 30V AOD478

PWM0/GPIO
VCLK/GPIO
GPIO_8
LINE_INL/IICSCL/GPIO
LINE_INR/IICSDA/GPIO
PWM5/AUDIO_REF/SPDIF3/WS/GPIO
AUDIO_SOUTL/SCK/GPIO
AUDIO_SOUTR/MCK/GPIO
AUDIO_HOUTL/SD0/GPIO
AUDIO_HOUTR/PWM0/GPIO
LS_ADC_VDD
VCLK/A-ADC0/GPIO
A-ADC1/GPIO
USB_DDCSCL1/A-ADC2/GPIO
USB_DDCSDA1/A-ADC3/GPIO
PWM4/GPIO
PWM1/PWM5/GPIO_USB
IICSCL_AUX/IICSCL/GPIO
IICSDA_AUX/IICSDA/GPIO
RXD/DDCSCL1/GPIO
TXD/DDCSDA1/GPIO
VCCK_1
PGND_1
PVCC_1
GPIO/PWM2/INT0/DVI_CTRL_OUT1
GPIO/PWM3/PWM0/SPDIF0/SD0/T2
Y2P-B JP111 25
G
24
VOUT 2012.02.23 Rating voltage EN VIN R120 0
1 24 S
5VS CLKOUTM-B JP112 23
THERMAL

R118 R119
25

270K 270K OVP VREF CLKOUTP-B JP113 22

2 23
1uF
R121 C174 C176 Y3M-B JP114 21
25V

R123
4.7K
100 R125 1000pF NC_1 CS
PWM_DIM 3 22 Y3P-B 20

4.7K
R124
33K 50V JP115
C172
19

R168
R146

R167

R170
R172
R166

R169
Y0M-A

R164

R173
R174
R165
R122 100pF PGND_1 NDRV DSUB_SDA JP116

R113
4 21

1
1

1
1
1
1

56
1

1
100K 50V 56 Y0P-A JP117 18
5VS 5VS R147
PGND_2 RSS R185 R186
DSUB_SCL 17

PC_SND_R
5 20 56
220K 30K 3.3V_VDD Y1M-A JP118 16
R179 PDIM COMP C148 MODON
R175 10K
6 19 Y1P-A JP119 15
10K R180 R181 4700pF
50V 14
2K 100K RISET RT R184 R187 R126 C179
7 18
Y2M-A JP120 13
39K 1.5K 1.5K 0.047uF
R178 C C171 5% 25V
R182 LS8 LS1 Y2P-A JP121 12
4.7K B Q101 1uF 8 17
A_DIM 10V 10K C114 C121 C122
MMBT3904(NXP) 11

56
1uF C116 0.1uF 0.1uF CLKOUTM-A JP124

56
1%

R144
LS7 LS2 10V 1uF 16V

R145
16V
2012.05.19 E 9 16 10V CLKOUTP-A JP122 10
R183
Analog dimming C119 C120
16K
LS6 LS3 1uF 0.1uF Y3M-A JP125 9
1% 10 15 10V 16V
Y3P-A JP126 8
5VS 12V_LIPS

SOUND_L
WP_24C02

KEY0

KEY1
SOUND_R
LS5 LS4

DP_SINK_ASS1
PC_SND_R
PC_SND_L
/RST_HUB
11 14 7

DP_SINK_ASS2
130722
Improve Inrush VCOM-SCL JP134 6

NON 24"
NC_2 LGND Q108,R151,R152 APPLY
12 13 VCOM-SDA

24"
R177 1K->2.7K JP135 5

R159

R160
3.3V_VDD

0
C147 1uF->4.7uF
ITLC JP136 4
R329
VOUT 0 3
ZXMP3F30FHTA PanelOPT(Non-ITLC) 1/16W
Q108 Q107 5%
2
V-com:R138,R139,R141,R142 5VS R151 JP127
MMBT3904(NXP)

D
R141 R142
L104 1K 1

JP128
Only used for LGD Panelbiz model
4.7K 4.7K
JP130
C C150 C153
C177 R188 R176 C147 1uF R191

G
UBW2012-121F 33

JP132
JP129 JP131
1uF B 22K 4.7uF 25V 1000pF 1K
100K 25V
50V VCOM-SDA 50V
33 R139 R162 10031HR-30
C180 R152
33uF VCOM-SCL 4.7K E 0
100V R138 C149 P101
C178 R189 READY 1uF
1/16W R177

12507WR-06L
1uF 100K When apply LGD panel ,With ITLC pin : 5% 25V
2.7K READY

1
50V
Interlace mode :use R238 & R240 C C199

P100
4.7uF

7
Normal mode: use R239 MODON
Other panel :keep R238 R239 R240 Ready
B Q105 25V
MMBT3904(NXP)
R163
4.7K E
R171
4.7K
READY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 14 B2B #5 2013-07-24
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. SCALER 1 3
ESD_HDMI_NXP ESD_HDMI_NXP
D201-*1 D202-*1
JK202
ADUC 5S 02 0R5L

ADUC 5S 02 0R5L

ADUC 5S 02 0R5L

IP4283CZ10-TBA IP4283CZ10-TBA
KCN-DS-3-0062
DVI INPUT TMDS_CH1- 1
TMDS_CH1+ 2
10 NC_4
9 NC_3
TMDS_CH1- 1
TMDS_CH1+ 2
10 NC_4
9 NC_3
DSUB INPUT
GND_1 3 8 GND_2 GND_1 3 8 GND_2
TMDS_CH2- 4 7 NC_2 TMDS_CH2- 4 7 NC_2
TMDS_CH2+ 5 6 NC_1 TMDS_CH2+ 5 6 NC_1
5.5V

5.5V

5.5V

75
75

75

JK203 DVI2-
VA200

VA201

VA202

DVI28D-24HS1YN4A
R205

(OPT)ESD_HDMI_SEMTECH R222
R203

R204

DVI1-
D201 10
RCLAMP0524PA DVIC-
6 6 17 9 1 10 1 R221
10
GNDR 9 2
11 8 3 R223
DVIC+
10
1 18 10 2 DVI2+ 7 4
11 DVI2-
1 6 5

DVI1+
R224
RED 10

DVIC-

DVIC+
DVI2+
7

DVI0-
19 11 3
7 JP204
GNDG
12
2 12 DSUB_SDA 20 12 4

DVI0+
2 (OPT)ESD_HDMI_SEMTECH R225 DVI_HPD
D202 10
GREEN RCLAMP0524PA DVI1-
8 8 21 13 5 10 1 R226
10
D204

0.1uF
GNDB 9 2 KDS184

C213
DVI1+ MMBD301LT1G

16V
13 JP202 8 3 R228 A2 DVI_5V
HSYNC 10 D203 C
3 13 22 14 6 7 4
R227 DVI0- A1
3 6 5 10 5VS
BLUE JP203 DVI0+
9 9 23 15 7 DVI_SCL
IC201

R233 4.7K

R234 4.7K
14 M24C02-RMN6T
DVI_SDA

1/16W
4 14 VSYNC 24 16 8

R235
10K
4

5%
E0 1 VCC
3.3V_VDD 8

5.6V READY

READY

READY

READY

READY
10 10 R220 E1 2 WC WP_24C02
10K 7
15 JP205
DVI_DET
ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

20V

20V

20V

20V
5 15 DSUB_SCL E2 SCL R231 33 DVI_SCL
3 6
5 DVI_HPD
DSUB_DET R219 10K VSS SDA R232 33 DVI_SDA

68pF

C207 68pF
4 5
C203 68pF

C205 68pF

3.3V_VDD
C202 68pF

C204 68pF

VA208

VA209

VA210

VA211

VA213
ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

DVI_5V

ADMC 5M 02 200L
20V

20V

20V

20V

20V

25 C208

C206
R215
16 10K 0.1uF
R209 4.7K
R210 4.7K

16V
16
VA203

VA204

VA205

VA206

VA207

130718
ESD protection
EAF61530301
->EAF61530101
DP INPUT R236
15K
1W AUDIO
5VS
5VS IC200
R216
READY
C APA2068KAI-TRL[EP]
R217 C217
4.7K 10K B Q201 R_SPK_OUT-
MUTE 0.01uF
(1) MMBT3904-(F)
50V MUTE ROUT-
C212 1 16
0.01uF E R_SPK_OUT+

THERMAL
130722 READY 50V

17
SHUTDOWN VDD_2
DP jack type change 2 15 5VS
EAG63191401->EAG63112702 C224 C225 JP211
RIN- ROUT+ 0.1uF 4.7uF R_SPK_OUT+
SOUND_R 3 14 16V 10V 4
GND_2

GND_2

JK700
NC_4

NC_3

NC_2

NC_1

NC_4

NC_3

NC_2

NC_1

6.2K
R229
JP212

READY
BYPASS SE/BTL R_SPK_OUT-
10

10

6
3VD51203-L7JJ-9H 4 13
IP4283CZ10-TBA

IP4283CZ10-TBA

3
READY

READY

C215 R237
D700 D702 JP213
4.7uF GND_1 GND_2 1K L_SPK_OUT+
1 ML_LANE_3- SOUND_L 10V 5 12 2
1

5
1
TMDS_CH1-

TMDS_CH1+

GND_1

TMDS_CH2-

TMDS_CH2+

TMDS_CH1-

TMDS_CH1+

GND_1

TMDS_CH2-

TMDS_CH2+

6.2K
R218
READY
5VS R211 JP214
2 GND0 LIN- LOUT+
2 15K L_SPK_OUT-
6 11 L_SPK_OUT+ 1
3 ML_LANE_3+
3 DP_3N R213 R214
4 ML_LANE_2- 0 2K VOLUME VDD_1
4 7 10
DP_3P C216 SMAW200-04
5 GND1 0.01uF
5 DP_2N C VOLMAX LOUT- P200
R212 C211 50V 8 9
6 ML_LANE_2+ 1uF L_SPK_OUT-
6 1K B Q200

0
DP_2P

R247
(1) VOLUME MMBT3904-(F) 10V
7 ML_LANE_1-
7 DP_1N READY
E
8 GND2 READY
8 DP_1P
9 ML_LANE_1+
9 DP_0N
10ML_LANE_0-
10 DP_0P
11 GND3
11 R701
10K
12 ML_LANE_0+ 3.3V_DP
12
R710
13 GND 1K
13 DP_DET DP_SINK_ASS1
14 GND 1/10W
14 5%
R707
15 AUX_CH+ 0
15 AUX_CHP
16 GND4
16
R708
17 AUX_CH- 0
17 R700 AUX_CHN
18 HOT_PLUG 1K
18 READY
DP_HPD R703 1M R705 1M R709
19 RETURN 3.3V_DP 1K
19
DP_SINK_ASS2

TMDS_CH2+

TMDS_CH2-

TMDS_CH1+

TMDS_CH1-
L700 3.3V_DP PC AUDIO IN

C210
20 DP_PWR[3.3V] 1/10W

1uF
10V
GND_1

READY

R702
100K
20 R704 1M R706 1M R207
5%
3.3V_DP 15K

IP4283CZ10-TBA
5

1
READY PC_SND_R
21 C700 C701 6 M6
4.7uF 0.1uF D701 R201
SHIELD C201 R208

READY
10V 16V VA215 470K 10K
1 M1 220pF

10
JP200 20V READY

9
50V

NC_1

NC_2

GND_2

NC_3

NC_4

C209
1uF
10V
3 M3_DETECT R202
JP201 15K
PC_SND_L
4 M4
JP206 C228 R206
R200 10K
220pF

READY
470K READY
5 M5_GND 50V
KJA-PH-1-0177 VA214
JK200 20V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 14 B2B #5 2013-07-24
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Signal Interface 2 3
USB power source selection
L801 L802 L803 R806 R817
BUS power X X O X O
SELF power O O X O X
5VS L802
BLM18PG121SN1D USB_5V
USB 2 Down stream
3.3V_VDD
L801
READY
3.3V_USB
USB UP stream
BLM18PG121SN1D
ADUC 5S 02 0R5L

ADUC 5S 02 0R5L

READY
VA800

VA801
USB 3.3 LDO(AZ1117)
IC804
AZ1117H-3.3 C827
JP804
0.1uF
USB_5V
16V
UAR24-4K2300

INPUT 3 2 OUTPUT
3.3V_USB
USB UP STREAM

USB_UP_D-
3

2
P801

1 C828 C829 JP801

UAR64-8K2300
C830 C831

4
ADJ/GND USB_UP_D+ USB_GND

P802
10uF 4.7uF 1uF 1000pF JP802
10V 50V JP805
16V 10V

USB DOWN STREAM

USB_GND USB_DP2
READY JP806
4

3
USB_5V USB_DP1
JP803 JP807
USB_UP_D+
USB_UP_D-

L803 USB_DM2
C806

(OPT)USB 3.3 LDO(KIZ1117)

5
1uF
10V

MLB-201209-0120P-N2 JP808
IC804-*1

2
C813 USB_DM1
KIA1117ST33 USB_DET JP809
0.1uF
16V L806 OUT2
IN OUT JP810
MLB-201209-0120P-N2
SUSP_IND/LOCAL_PWR/NON_REM[0]

1
3 2
OUT1

ADUC 5S 02 0R5L
VA802

ADUC 5S 02 0R5L
VA803

ADUC 5S 02 0R5L
VA804

ADUC 5S 02 0R5L
VA805
0.1uF

1
C807

16V

GND/ADJ
C808 C810
20pF 20pF
50V 50V
R802
1M 1%
R801

USB_DET 3.3V_USB 3.3V_USB

12K
1%

R803
100K
1/10W

XTALIN/CLKIN

X801
24MHz
R808 USB_5V
USBDP_UP
USBDM_UP
VDDA33_3
R807 100K
[EP]VSS
VDD33_3

PLLFILT

XTALOUT

R810
100K
3.3V_USB

0
RBIAS

IC802
AP2191SG-13
R809 READY L804 R813
C812 4.7K
100K /RST_HUB MLB-201209-0120P-N2 NC 8 1
GND
1uF
10V OUT1 120-ohm OUT_2 IN_1
C815 7 2
36
35
34
33
32
31
30
29
28
USBDM_DN[1] 1 27 VBUS_DET 0.1uF OUT_1 IN_2
USB_DM1 6 3
THERMAL 16V R815 C823 C819 C821
USBDP_DN[1] 2 26 RESET_N C825 C838 C839 C840 C841 FLG
5 4
EN
4.7uF4.7uF
USB_DP1 37 10uF 10uF 10uF 10uF 10uF 2.7K 0.1uF
EAN60921001 10V 10V
USBDM_DN[2] 3 25 HS_IND/CFG_SEL[1] 6.3V 6.3V 6.3V 6.3V 6.3V USB_CTL1 16V
USB_DM2 3.3V_USB READY READY READY READY
USBDP_DN[2] SCL/SMBCLK/CFG_SEL[0] R817 100K C833
USB_DP2 4 24 4.7uF
IC801 10V
VDDA33_1 5 USB2512B-AEZG 23 VDD33_2
C801 C802 C803 C804 C805 NC_1 SDA/SMBDATA/NON_REM[1] R811 0
6 22 USB_OCD1
NC_2 7 21 NC_8
1uF 0.1uF 0.1uF 0.1uF 0.1uF
10V 16V 16V 16V 16V NC_3 8 20 NC_7
3.3V_USB
NC_4 NC_6

R804 100K

R805 100K

R806 100K
9 19

10
11
12
13
14
15
16
17
18

READY
USB_5V

VDDA33_2
TEST

USB_CTL1 PRTPWR[1]/BC_EN[1]
OCS_N[1]
CRFILT
VDD33_1
PRTPWR[2]/BC_EN[2]
OCS_N[2]
NC_5
IC803
AP2191SG-13
3.3V_USB L805 R814
MLB-201209-0120P-N2 NC
8 1
GND 4.7K
C814 C816 OUT2 120-ohm OUT_2 IN_1
7 2

0.1uF
C811
4.7uF
0.1uF OUT_1 IN_2

16V
6 3
R816 C824 C820 C822
16V 10V C826 C834 C835 C836 C837 FLG EN
2.7K 4.7uF4.7uF
5 4
10V 10V 0.1uF
10uF 10uF 10uF 10uF 10uF 16V
6.3V 6.3V 6.3V 6.3V 6.3V
EAN60921001
USB_CTL2
READY READY READY READY

C809
C832

1uF
10V
4.7uF
10V

USB_CTL2
USB_OCD1

USB_OCD2
R812 0
USB_OCD2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 14 B2B #5 2013-07-24
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. USB 3 3