WQSLED Company Profile
WQSLED Company Profile
In 2011, we developed the 1st generation of COBIP (Chip On Board Integrated Packaging), as the first generation innovation
of bracket-free & pinless integrated packaging system technology, has outstanding innovation in the field of LED display.
In 2019, we developed the 2nd generation COCIP (Chip On Chip Integrated Packaging) technology based on innovative
system technology to provide a more advanced fully de-pinned lamp drive integrated packaging panel technology solution for
LED display panel manufacturing. This is a high-end manufacturing technology for LED display panels that will bring a
qualitative leap to the overall reliability of LED display systems.
In 2024, we are developing the LED film with COCIP technology for both LED chips and the driver chips on the film without
brackets either pins for much less resistance and less heat.
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Product profile
2, LED see-through indoor/outdoor screens for both rental & fixed installation.
3, LED linear screens, digital signs for guidance, emergency signs etc.
(built with wifi hotspot to change content easily)
1, Mobile LED display in IOT
solutions, with cloud management