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SPECIFICATION

REFOND P/N
RF-P**MI32DS-BF-N-Y
RF-H**HI32DS-EF-2N-03

□
■Mass Product

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Contents

1. Description .................................................................................................................................. 3
1.1General Description .................................................................................................................. 3
1.2Features ..................................................................................................................................... 3
1.3Application ................................................................................................................................. 3
1.4Package Dimension ................................................................................................................. 4
1.5Product Parameters ................................................................................................................. 5
1.6 Bin Range Of Forward Voltage and Luminous Flux BIN ................................. 7
1.7Electro-Optical Characteristics ............................................................................................... 7
1.8Typical optical characteristics curves ................................................................. 10
2. Packaging ............................................................................................................................... 14
2.1 Packaging Specification ....................................................................................................... 14
2.1.1Carrier Tape Dimension ....................................................................................... 14
2.1.2Reel Dimension ..................................................................................................... 14
2.1.3Label Form Specification ..................................................................................... 15
2.2Moisture Resistant Packing .................................................................................................. 15
2.3Cardboard Box ........................................................................................................................ 15
2.4 Reliability Test Items And Conditions ........................................................ 16
2.5 Criteria For Judging Damage ...................................................................................... 17
3. SMT Reflow Soldering Instructions SMT ....................................................................... 18
3.1SMT Reflow Soldering Instructions SMT ........................................................................ 18
4. Handling Precautions .............................................................................................. 20
4.1 Handling Precautions ............................................................................................ 20

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1. Description

1.1General Description

The White LED which was fabricated using a blue chip and the phosphor
Product Package:2.75mmX3.5mmX0.7mm
LED 2.75mmX3.5mmX0.7mm

1.2Features

►PLCC-2Package.PLCC-2
►Extremely wide viewing angle.
►Suitable for all SMT assembly and solder process.
►Available on tape and reel.
►Moisture sensitivity level: Level 3.
►RoHS compliant.
►PCT Leadframe.

1.3Application

►Indoor lighting.

►Tube lighting.
►General indoor applications.

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1.4Package Dimension

2.75
A C

0.70
3.50

Fig.1-1 Top view Fig.1-2 Side view

0.48

﹢ -
A C
1.80

Polarity
A:anode
0.96 2.06
C:cathode

Fig.1-3 Bottom view Fig.1-4 Polarity

0.50
2.10

1.10 2.10

Fig.1-5 Soldering patterns

Notes

All dimensions units are millimeters.

All dimensions tolerances are 0.05mm unless otherwise noted.

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1.5Product Parameters
Table 1-1 Electrical / Optical Characteristics at Ts=25°C
Value
Item Code Symbol Test Condition Unit
Min. Typ. Max.
项目 符号 测试条件 单位
（最小值） （典型值） （最大值）
Rank F1 2.6 2.7 V
Forward Voltage
Rank F2 VF IF =60mA 2.7 2.75 2.8 V
（正向电压）
Rank G1 2.8 2.9 V
Rank RFD 30 31 lm
RF-H27HI32DS-EF-2N-03 Rank RFE 31 32 lm
Φ IF =60mA 31.9
(ERP2700K) Rank RFF 32 33 lm
Rank RGB 33 34.5 lm
Rank RFE 31 32 lm
RF-H30HI32DS- EF-2N-03
Rank RFF Φ IF =60mA 32 33.6 33 lm
(ERP3000K)
Rank RGB 33 34.5 lm
Rank RFE 31 32 lm
RF-H35HI32DS- EF-2N-03
Rank RFF Φ IF =60mA 32 33.6 33 lm
(ERP3500K)
Rank RGB 33 34.5 lm
Rank RGB 33 34.5 lm
RF-H40HI32DS-EF-2N-03
Rank RGC Φ IF =60mA 34.5 35.5 36 lm
(ERP4000K)
Rank RHB 36 38 lm
Rank RGB 33 34.5 lm
RF-H50HI32DS-EF-2N-03
Rank RGC Φ IF =60mA 34.5 35.5 36 lm
(ERP5000K)
Rank RHB 36 38 lm
Rank RGB 33 34.5 lm
RF-H57HI32DS-EF-2N-03
Rank RGC Φ IF =60mA 34.5 35.5 36 lm
(ANSI5700K)
Rank RHB 36 38 lm
Rank RGB 33 34.5 lm
RF-H65HI32DS-EF-2N-03
Rank RGC Φ IF =60mA 34.5 35.5 36 lm
(ERP6500K)
Rank RHB 36 38 lm
Reverse Current（ ） IR VR=5V --- --- 10 uA
Viewing Angle（发光角度） 2θ1/2 --- 120 --- deg
Ra 80 --- --- ---
Color Rendering Index（显色指数） IF =60mA
R9 0 --- --- ---
Thermal Resistance.（热阻） RTHJ-S --- 12 --- ℃/W

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Table 1-2 Absolute Maximum Ratings at Ts=25°C

Parameter Symbol Rating Units

Power Dissipation PD 870 mW

Forward Current IF 300 mA

Peak Forward Current IFP 360 mA

Reverse Voltage VR 5 V

Electrostatic Discharge(HBM) ESD 2000 V

Operating Temperature TOPR -40 ~ +105 ℃

Storage Temperature TSTG -40 ~ +100 ℃

Junction Temperature TJ 125 ℃

Notes

1. Pulse width≤0.1ms, duty cycle≤1/10. ≤ ≤

2. The above forward voltage measurement allowance tolerance is ±0.1V.

3. The above color coordinates measurement allowance tolerance is±0.005. ±0.005.

4. The above luminous intensity measurement allowance tolerance ±10%.

.Theabovecolorrenderingindexmeasurementallowancetoleranceis±2.

6. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.

7. All measurements were made under the standardized environment of Refond.

8.When the LEDs are in operation the maximum current should be decided after measuring the package
temperature,junction temperature should not exceed the maximum rate

9. ESD yield is over 90% at 2000V ESD (HBM). ESD protection during products handing is needed.

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1.6 Bin Range Of Forward Voltage and Luminous Flux BIN

Table 1-3

F1 F2 G1 / / /
VF(V) 60mA
2.6-2.7 2.7-2.8 2.8-2.9 / / /

RFD RFE RFF RGB RGC RHB

Φ (LM) 60mA
30-31 31-32 32-33 33-34.5 34.5-36 36-38

1.7Electro-Optical Characteristics

Table 1-4

60mA 2.6-2.7 2.7-2.8 2.8-2.9 / / /

VF(V)
150mA 2.77-2.87 2.87-2.97 2.97-3.07 / / /

60mA 30-31 31-32 32-33 33-34.5 34.5-36 36-38

Φ (LM)
150mA 72.5-74.8 74.8-77.5 77.5-79.5 79.5-83 83-86.5 86.5-91.5

Note:

LM &VF Values are for representative reference only.

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Y
E27
-1

2
7-
E2
E27-C

4
7-
E2
E3 E27
0- -3
1

2
E3

0-
5-

E3
C
1 E30-

4
0-
2
5-

E3
E3

E3
-C 0-
E35
3
E4

4
0-

5-
1 E3

E3
5-

2
3

0-
C
0-

E4
E4

4
0-
E4
E4
0-
E50 3
-1
-2

C
0-
E50

E5
-4
E50

A57 E50
-1 -3
E65
-2

-1 C
7-
A57

-4

A5
A57
-2

C
5-
-4
E65

E6 A57
E65

-3
E65
-3

Fig 1-6 The C.I.E Chromaticity Diagram CIE

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Table 1-4 Color Coordinates

ERP

BIN CODE X Y a b θ Tc(K)

E27-C(3Step) 0.00774 0.00411 2665-2790K

0.4630 0.4200 57.28
E27-1/2/3/4(5Step) 0.01290 0.00685 2625-2840K

E30-C(3Step) 0.00834 0.00408 2860-3020K

0.4400 0.4030 53.17
E30-1/2/3/4(5Step) 0.01390 0.00680 2810-3080K

E35-C(3Step) 0.00951 0.00417 3335-3555K

0.4090 0.3940 53
E35-1/2/3/4(5Step) 0.01585 0.00695 3270-3635K

E40-C(3Step) 0.00939 0.00402 3895-4180K

0.3800 0.3800 54.00
E40-1/2/3/4(5Step) 0.01565 0.00670 3810-4285K

E50-C(3Step) 0.00822 0.00354 4815-5165K

0.3460 0.3590 59.62
E50-1/2/3/4(5Step) 0.01370 0.00590 4710-5295K

E65-C(3Step) 0.00669 0.00285 6200-6690K

0.3130 0.3370 58.38
E65-1/2/3/4(5Step) 0.01115 0.00475 6085-6875K

ANSI

BIN CODE X Y a b θ Tc(K)

A57-C(3Step) 0.00746 0.00320 5450-5945K

0.3287 0.3417 59.09
A57-1/2/3/4(5Step) 0.01243 0.00533 5320-6085K

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1.8Typical optical characteristics curves

350

300

250
Forward Current

200
(mA)

150

100

50

0
2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3
Forward Voltage (v)

Fig 1-7Forward Voltage Vs. Forward Current

420
390
360
330
Relative Intensity(%)

300
270
240
210
180
150
120
90
60
30
0
0 30 60 90 120 150 180 210 240 270 300
Forward Current (mA)

Fig 1-8 Forward Current Vs. Relative Intensity

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120

110
Relative Luminous Flux (%)

100

90

80

70

60

50

40
25 30 35 40 45 50 55 60 65 70 75 80 85

Ts(℃)

Fig 1-9Solder Temperature Vs Relative Intensity

350

300
Forward Cureent（mA）

250

200

150

100

50

0
0 10 20 30 40 50 60 70 80 90 100 110 120

Ts(℃)

Fig 1-10Solder Temperature Vs.Forward Current

Tj 125
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2.8

2.75
Forward Voltage (v)

2.7

2.65

2.6

2.55
5 25 45 65 85 105
Ts(℃)

Fig 1-11Forward Voltage Vs Solder Temperature

120
110
100
90
Relative Luminous Intensity(%)

80
70
60
50
40
30
20
10
0
-100 -80 -60 -40 -20 0 20 40 60 80 100

Angle(º)

Fig 1-12Radiation diagram

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120
2700K

100 3000K
Relative Emission Intensity (%)

4000K
80 5000K
5700K
60
6500K

40

20

0
400 450 500 550 600 650 700 750 800
Wavelength [nm]

Fig 1-13Spectrum Distribution

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2. Packaging

2.1 Packaging Specification

Package: Max 16000pcs/reel or 4000pcs/reel. 16000pcs 4000pcs。
2.1.1Carrier Tape Dimension

FEED DIRECTION
Polarity
Mark
2.00 4.00 1,55

1,75
5,24

﹢
3,84
TOP
Tape

0,95 3,02

Fig.2-1 Carrier Tape Dimension

2.1.2Reel Dimension

Table 2-1 Title

16000pcs 4000pcs
B
C

A 12.7 0.3mm 11.75 0.3mm

D

B 330.2 2mm 177.8 0.2mm

A C 79.5 0.2mm 58.5 0.2mm

Label 标签
Fig.2-2Title
D 14.3 0.2mm 13.5 0.2mm
Notes

The tolerances unless mentioned ±0.1mm. Unit : mm注：未注公差为±0.1毫米 尺寸单位：毫米

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2.1.3Label Form Specification

Table 2-2 Title

PART NO. Part Number

SPEC NO. Spec Number
PART NO.
LOT NO. Lot Number
SPEC NO. BIN CODE Bin Code
LOT NO.
Ф Luminous flux
：
BIN CODE
Ф： XY： XY Chromaticity Bin
VF：
VF Forward Voltage
QTY:
QTY Packing Quantity
DATE:
DATE Made Date

Fig 2-3 Title

2.2Moisture Resistant Packing

Moisture Barrier Bag Label

防潮袋 标签
Reel
卷盘

ATTENTION
OBSERVE
PRECAUTIONS

FOR HANDLING
ELECTROSTATIC
SENSITIVE DEVICES

Label
标签

Fig.2-4Title

2.3Cardboard Box

深圳市瑞丰光电子股份有限公司
SHENZHEN REFOND OPTOELECTRONICS CO.LTO.

Fig.2-5Title
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2.4 Reliability Test Items And Conditions

Table 2-3 Title

TestItems Ref.Standard Test Condition Time Quantity Ac/Re

/

Reflow Temp:260 max

JESD22-B106 2times 10pcs 0/1
T=10 sec

-40 15min
Thermal Shock JEITAED-4701
↑↓10s 200cycles 10pcs 0/1
300307
100 15min

High Temperature Storage JEITAED-4701

Temp:100 1000hrs 10pcs 0/1
200201

Low Temperature Storage JEITA ED-4701

Temp:-40 1000hrs 10pcs 0/1
200202

Life Test Ta=25

JESD22-A108 1000hrs 10pcs 0/1
IF=60mA

High Temperature
High Humidity Life Test 60 / 90%RH
JESD22-A101 1000hrs 10pcs 0/1
IF=60mA

Temperature
Humidity Storage JEITA ED-4701 TA=85
1000hrs 10pcs 0/1
100 103 RH=85%

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2.5 Criteria For Judging Damage

Table 2-4 Title

Criteria For Judgement

Test Items Symbol Test Condition

Min. Max.

Forward Voltage
VF IF=60mA - (U.S.L*)x1.1

Reverse Current
IR VR = 5V - (U.S.L*)x2.0

Luminous Flux
Ф IF=60mA (L.S.L*)x0.7 -

Notes

1.U.S.L: Upper standard level L.S.L: Lower standard level

2. The above reliability tests are based on the verification of a single/strip LED of Refond's existing experimental

platform,the reliability experimental was taken under good heat dissipation conditions.When customers applies

the LED to the series and parallel circuit,should take consideration of all the factors such as the current,voltage

distribution,heat dissipation and others. / LED

LED

3.The technical information shown in the data sheets are limited to the typical characteristics and circuit

examples of the referenced products. It does not constitute the warranting of industrial property nor the granting

of any license.

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3. SMT Reflow Soldering Instructions SMT

3.1SMT Reflow Soldering Instructions SMT

tp Critical Zone
TP
Ramp-up T L to T P

TL
Temperature

TS max tL

TS min

ts
Preheat Ramp-down

25
t 25℃ to Peak
Time

Fig.3-1Title
Table 3-1Title

Average temperature rise speed Tsmax TP 3 °C/ Max 3 °C/ s

Preheating: minimum temperature (Tsmin) 150 °C

Preheating: Max temperature (Tsmax) 200 °C

Preheating: Time Tsmin Tsmax 60 - 120 60s-120s

Time limited to maintain high temperature: the temperature

217 °C
(TL)

Time limited to maintain high temperature: The Time

60 Max 60s
(tL)

Peak /Classification of temperature: / (TP) 260 °C

Time limit classification of peak temperature time

10 Max 10s
tp

Hold time within 5 C with the actual peak temperature (TP)

30 Max 30s
(TP) 5 °C

Cooling speed 6 °C/ Max 6 °C/ s

Needed time from 25 °C to Tp25 °C 8 Max 8 minutes

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Notes

(1)Reflow soldering should not be done more than two times. In the case of more than 4 hours passed

soldering after first, LEDs will be damaged.

(2)Whensoldering , do not put stress on the LEDs during heating.

3.1.1 Soldering Iron

(1) When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds

(2) The hand solder should be done only one time.

3.1.2 Repairing

Repair should not be done after the LEDs have been soldered. When repairing is
unavoidable,a double-head soldering iron should be used (as below figure). It should be
confirmed in advance whether the characteristics of LEDs will or will not be damaged by repairing.
LED

3.1.3 Cautions

(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on
the top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when
usethe picking up nozzle, the pressure on the silicone resin should be proper. LED

(2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering,
do not warp the circuit board.LED

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(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering. Do not rapidly cool device after soldering.

4. Handling Precautions

4.1 Handling Precautions

(1) LED operating environment and sulfur element composition cannot be over 100PPM in the
LEDmating usage material. This is provided for informational purposes only and is not a warranty
or endorsement.LED

(2) In order to prevent ex-ternal material from getting into the inside of LED, which may cause the
malfunction of LED, the single content of Bromine element is required to be less than
900PPM,the single content of Chlorine elementis required to be less than 900PPM,the total
content of Bromine element and Chlorine element in the external materials of the application
products is required to be less than 1500PPM. This is provided for informational purposes only
and is not a warranty or endorsement.

(3) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues. Refond advises against theuse of any chemicals or materials that have been found
or are suspected to have an adverse affect on device performance or reliability. To
verifycompatibility, Refond recommends that all chemicals and materials be tested in the specific
application and environment for which they are intended tobe used. Attaching LEDs, do not use
adhesives that outgas organic vapor.

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(4) Handle the component along the side surface by using forceps or appropriate tools; do not
directlytouch or Handle the silicone lens surface, it may damage the internal circuitry.

Fig 4-1 Title

(5) In designing a circuit,the current through each LED can not be exceed the absolute maximum
rating specified for each LED.In the meanwhile,resistors for protection should be
applied,otherwise slight voltage shift will cause big current change,burn out may happen. The
driving circuit must be designed to allow forward voltage only when it is ON or OFF.If the reverse
voltage is applied to LED, migration can be generated resulting in LED damage.

(6) Thermal Design is paramount importance because heat generation may result in the
Characteristics decline,such as brightness decreased,Color change and so on.Please consider
the heat generation of the LEDs when making the system design.LED

(7) Compared to standard encapsulants, silicone is generally softer, and the surface is more likely
to attract dust,requiring special care during processing. In cases where a minimal level of dirt and
dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface
after the soldering of components. Refond suggests using isopropyl alcohol for cleaning. In case

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other solvents are used, it must be assured that these solvents do not dissolve the package or
resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.

Table 4-1Storage

Conditions Temperature Humidity Time

Before Opening Aluminum Within 1 Year From

Bag 30 75% Date
Storage
储存
After Opening Aluminum Bag 168hours
30 60%
168

Baking 24hours
60 5 5%
24

(8) If the moisture absorbent material（silica gel）has faded away or the LEDs have exceeded
the storage time，baking treatment should be performed after unpacking and based on the
following condition（60±5）℃ for above 24 hours.

If the package is flatulence or damaged,please notify the sales staff to assist.

(9)Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and
Electrical Over Stress (EOS).

(10) Other points for attention, please refer to our relevant information.

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Version History/

Date Revisor Version Verifier Remarks

2022-6-28 甘华 E/0 廖志伟 初版发行

增加R9>0
2022-11-17 甘华 E/1 廖志伟
调整亮度均值

2023-05-12 邬亚俊 E/2 廖志伟 更新亮度

2023-07-19 徐恒 E/3 廖志伟 规格书更新

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Declare
This specification is written both in English and in Chinese and the latter is formal.

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