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Rapid Prototyping & Manufacturing: ENGI 7962 Computer-Aided Engineering

The document discusses rapid prototyping and manufacturing (RP&M) technologies. It provides an overview of the basic principles of RP&M, including that a 3D CAD model is mathematically sliced into layers and the part is built one layer at a time. The document also describes some commonly used RP&M techniques like stereolithography, solid ground curing, selective laser sintering, and laminated object manufacturing. It provides details on the capabilities and costs of different RP&M systems.

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Zaheer Ahamed
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Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
31 views

Rapid Prototyping & Manufacturing: ENGI 7962 Computer-Aided Engineering

The document discusses rapid prototyping and manufacturing (RP&M) technologies. It provides an overview of the basic principles of RP&M, including that a 3D CAD model is mathematically sliced into layers and the part is built one layer at a time. The document also describes some commonly used RP&M techniques like stereolithography, solid ground curing, selective laser sintering, and laminated object manufacturing. It provides details on the capabilities and costs of different RP&M systems.

Uploaded by

Zaheer Ahamed
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Rapid Prototyping &

Manufacturing

ENGI 7962 Computer-Aided Engineering


Outline
• Why RP&M Technology?
• Basic Principles
• C
Currently
tl A
Available/Developing
il bl /D l i S Systems
t
• Directions for RP&M Research

ENGI 7962 Computer-Aided Engineering


R&D Directions in
Manufacturing
• Intelligent Manufacturing Control
• Equipment Reliability & Maintenance
• Advanced Materials
• P d t Realization
Product R li ti
• Education & Training

ENGI 7962 Computer-Aided Engineering


Product Realization
• Multidisciplinary
• Concurrent, life cycle design teams
• I t lli
Intelligent
t product
d t models
d l
• Common databases across all functions
(eg. engineering, planning, marketing, ...)
• Management
g of PRP
• Time to market is critical and prototypes
used to aid communication
ENGI 7962 Computer-Aided Engineering
History of Prototyping
• Artist/Craftsperson created model
• Development of CAD
• CAD d databases
t b usedd tto generate
t CNC
programs. Subtractive processes.
• Development of additive processes ...
generally called “Rapid Prototyping”.

ENGI 7962 Computer-Aided Engineering


Definition
• A process by which a solid physical model
of a part is made directly from a 3-D CAD
drawing without unique tooling or fixtures
fixtures.
• Referred to as
– Desktop
D kt Manufacturing
M f t i
– Automated Fabrication
– Tool-less
T ll M
Manufacturing
f i
– Free-form Fabrication

ENGI 7962 Computer-Aided Engineering


Goals of Rapid Prototyping
• Substantially reduce product development
time, through rapid creation of 3D models.
• Improve communication (visualization)
within multidisciplinary design teams.
• Address
Add iissues off iincreased
d flflexibility
ibilit &
small batch sizes, while remaining
competitive
titi ((rapidid manufacture).
f t )

ENGI 7962 Computer-Aided Engineering


Basics
• Require a geometric model
model.
• Must include surface information.
• Usually
U ll solid
lid modeling
d li system:
t
• CATIA, I-DEAS, Pro/Engineer, SolidWorks, etc
• Surface models require completely bound
volume and internal detail.

ENGI 7962 Computer-Aided Engineering


Basics (continued)
• 3D geometric model is mathematically
sectioned into parallel cross-sections.
• Each cross
cross-section
section creates a 2D binding
or curing path for model construction.
• Models
M d l are constructed
t t d one layer
l att a time
ti
until complete. Supports may be required.
• Two stages: Data preparation and model
production.
ENGI 7962 Computer-Aided Engineering
Data Preparation
• CAD data converted to .STL
STL format
format.
• .STL designed for 3D Systems Inc.
Stereolithography Apparatus (SLA).
(SLA)
• Triangular facets are used to describe the
shape
h off a closed
l d 3D model.
d l
• Faceted surface must be completely
bound.
pp
• Curved surfaces are approximated.
ENGI 7962 Computer-Aided Engineering
.STL Format
• Developed by Albert Consulting Group
• Consists
C i t off x, y & z coordinates
di t off triangles
ti l
• Example:
Ä solid
...
facet normal 0.00 0.00 1.00
outer loop
oute oop
vertex 2.00 2.00 0.00
vertex -1.00 1.00 0.00
vertex 0.00 -1.00 0.00
endloop
endfacet
...
endsolid

ENGI 7962 Computer-Aided Engineering


.STL
STL Format (continued)
• All adjacent triangles must share two
vertices.
• Translation software is either included in
CAD package or third party.
• Translator
T l t should
h ld provideid ability
bilit tto adjust
dj t
chordal deviation (ie. trade-off accuracy vs
fil size
file i and d processing
i time).
ti )

ENGI 7962 Computer-Aided Engineering


VRML vs .STL
STL
• Virtual Reality Modeling Language
• Developed through Silicon Graphics using their
Open
p Inventor ((.iv)) standard.
• Lead to “Tele-Manufacturing” as proposed by
Michael Bailey,y, U. of C.,, San Diego
g
• Take advantage of greater development effort
and utilize other features (e.g.. colour, colour
gradient, texture).
• STL still the dominant RP format

ENGI 7962 Computer-Aided Engineering


RP Production Technologies
• Stereolithography Apparatus presented at
Autofact show in November, 1987.
• Currently upwards of twenty different
technologies being developed/marketed.
• Major
M j diff
differences iin materials
t i l used
d and
d
build techniques.
• Various RP technologies outlined in
following slides.
ENGI 7962 Computer-Aided Engineering
Stereolithography Apparatus
(SLA) - 3D Systems
• Laser generated ultraviolet beam traces
out cross-section & solidifies liquid
polymer.
• Component is built in vat of liquid resin.
• Vat size limits prototype
• SLA-190 ((7.9 x 7.9 x 9.8”)) US$105,000
$ ,
• SLA-250 (10 x 10 x 10”) US$210,000
• SLA-250 (20 x 20 x 24”) US$420,000

ENGI 7962 Computer-Aided Engineering


Stereolithography Apparatus

ENGI 7962 Computer-Aided Engineering


Stereolithography (cont
(cont.))
• Materials – at least five currently available
available.
All are acrylates (non-reusable
thermosets).
thermosets)
• Accuracy - ranges from 0.1% to 0.5% of
overall dimension from small to large
parts. A very accurate RP technology.
• Curing
C i stability
t bilit and
d supportt structures
t t
remain challenges.

ENGI 7962 Computer-Aided Engineering


Solid Ground Curing / Photo-
masking - Cubital Ltd.
• Uses photo-masking to solidify whole
layers of photopolymer at one time.
• Solider 5600 (20 x 14 x 20”) US$550,000
with machine dimensions 13.5’ x 5.5’ x 5’
• Layer thicknesses of .004-.006” and
dimensional accuracy of 0.02”,
0.02 , building up
to 100 layers/hour.

ENGI 7962 Computer-Aided Engineering


Solid Ground Curing (cont.)

ENGI 7962 Computer-Aided Engineering


Solid Ground Curing (cont
(cont.))
• Full cure as built minimizes shrinkage and
eliminates post-curing.
• Wax eliminates need for supports
supports.
• Fly cutter provides for “undo” operation.
• System produces a lot of waste. Can’t
reuse material picked up during milling,
and uncured resin is a hazardous material.

ENGI 7962 Computer-Aided Engineering


Selective Laser Sintering -
DTM Corp
• Developed at U. of Texas at Austin
• Utilizes powder, rather that liquid polymer.
y
• Potential exists for different materials
including polycarbonate, PVC, ABS, nylon,
polyester, polyurethane and casting wax.
• Sinterstation 2000 (12”
(12 dia.
dia x 15”
15 dp)
US$425,000. Builds .4 - 2” per hour.

ENGI 7962 Computer-Aided Engineering


Selective Laser Sintering (cont
(cont.))

ENGI 7962 Computer-Aided Engineering


Selective Laser Sintering (cont
(cont.))
• Layers from .003
003 - .02
02” thick.
thick Accuracy
from .005 to .015” depending on size.
• Components can be recycled by crushing
and converting back to powder.
• Research
R h iis going
i iinto
t materials
t i l such
h as
powdered metals, ceramics and
composites.
it

ENGI 7962 Computer-Aided Engineering


Laminated Object
Manufacturing
• Process uses bonded sheet material.
Normally
yppaper,
p , but metals,, pplastics and
composites are possible.
• LOM
LOM-1015
1015 (14 x 15 x 10”)
10 ) US$95
US$95,000
000
LOM-2030 (30 x 20 x 20”) US$180,000
• Sheets of .002
002 - .02
02” thick.
thick
• Accuracy of +/- 0.005” achievable.

ENGI 7962 Computer-Aided Engineering


Laminated Object Manuf.
Manuf (cont.)
(cont )

ENGI 7962 Computer-Aided Engineering


Laminated Object Manuf.
Manuf (cont.)
(cont )
• Support provided by remainder of sheet
sheet.
• Prototypes less fragile than polymers.
• N iinternal
No t l stresses
t or curing
i shrinkage.
hi k
• Paper waste is non-hazardous.
• Machine can be operated in an office
environment.
• Cannot build hollow cavities as single part.

ENGI 7962 Computer-Aided Engineering


Three Dimensional Printing -
MIT
• Utili
Utilizes powdered
d d material,
t i l spread d outt one
layer at a time.
• Adhesive is applied in droplets through a
device similar to an inkjet printer head.
• Limited quantitative data available on
accuracy.y
• 3DP licensed to Soligen Inc. for Direct
Shell Production Casting process.
ENGI 7962 Computer-Aided Engineering
Three Dimensional Printing
(
(cont)
t)

ENGI 7962 Computer-Aided Engineering


Three Dimensional Printing
(
(cont.)
t)
• Internal supports not required
required.
• May require post processing, depending
on material and binder
binder.
• Work continues on limiting impact of
bi d d
binder drops, reducing
d i jjagged d ““print”
i t”
edges and flow control for the binder.
• Consortium includes Boeing, Hasbro,
Johnson & Johnson, 3M & United Tech.
ENGI 7962 Computer-Aided Engineering
Other RP Systems
• Fused Deposition Modeling - Stratasys
• uses .050” dia. thermoplastic filament

• Ballistic Particle Manufacturing


g - BPM
• uses three axis robotic system controlling an ink jet like deposition
head. Low cost, easy to operate system.

• Electrosetting - U.S.
U S Navy
• 2D profiles are used to “plot” electrode shapes which are attached
to foil. Multi-layer foil sandwich is immersed in liquid and energized.
M t i l iinside
Material id electrode
l t d solidifies.
lidifi S
Separately
t l controllable
t ll bl voltage
lt
and current provides for programmable density, hardness, etc.

ENGI 7962 Computer-Aided Engineering


Other RP Systems (cont.)
(cont )
• Masking & Depositing - Carnegie Mellon
• robotic control of metal spraying through a disposable, laser cut,
mask. A complementary mask is used to spray low melting point
support alloy.

• Shape Melting - Babcock & Wilcox


• controlled p
placement of ggas metal arc weldingg wire weld deposit.
p
Very closely controlled and monitored thermal conditions with
localized cooling allow for control over material properties.

• Innumerable Variations

ENGI 7962 Computer-Aided Engineering


R & D in Rapid Prototyping
• Part Accuracy Improvement
• mathematical
– use of CSG and ray tracing vs .STL
– improved facet approximations

• process related
– z step resolution
– layer registration

• material related
– material selection/development
p
– stress relief, alternate build techniques to reduce deformation
– additional processing (eg. shot peening)

ENGI 7962 Computer-Aided Engineering


R & D in Rapid Prototyping (cont.)
( t)
• Materials
• improvements to current materials
– current materials weak and fragile
– development of low-shrink, less brittle plastics
– introduction of glass, carbon or graphite fibre
– mixtures including ceramics are being tested

• focus
f on end-use
d material
t i l requirement
i t
– develop techniques to build with metal
– low melting point, binary metal powders
– d
deposition
iti off d
droplets
l t off molten
lt metal
t l ffrom a moving
i nozzle
l
– breakthrough RP design based on materials knowledge

ENGI 7962 Computer-Aided Engineering


R & D in Rapid Prototyping (cont.)
( t)
• Systems
• improvements to current technologies
– incremental improvements to specific RP technologies
– generic improvements, applicable to several RP types

• development of new RP technology


• development of implementation knowledge
– desktop manufacturing, automated fabrication, tool-less manufacturing,
free form fabrication
– workplace implications
– application identification and development

• virtual manufacturing, communications


• the personal factory
ENGI 7962 Computer-Aided Engineering
Examples of RP in Research
• Molecular Modeling
• Protein Kinase
• Molecular Docking Sites
• Earth Science
• Bathymetry
• Fault modeling
• Terrain surfaces
• Hurricane / meteorological modeling
• Ozone Hole over Antarctica

ENGI 7962 Computer-Aided Engineering


Examples of RP in Research
• Mechanical
• Specific component models
• Clearance, fit, function verification
• Design process development
• Medical
• Creation of mold blanks
• Customized devices for specific
p p
patients
• Mathematical Surface Visualization

ENGI 7962 Computer-Aided Engineering


Introduction to Rapid Tooling

• Defn: A process by which RP technology


is used to allow manufacturers to speed
p
up the prototype tooling process without
committingg to costly
y and time consuming
g
hard tooling.

ENGI 7962 Computer-Aided Engineering


Rapid Tooling
• Evolved dramatically in 1996
• RT allows user to build a tool that can
produce 100s
100s, 1000s
1000s, or even 1000000s
of parts quickly and at a lower cost.

ENGI 7962 Computer-Aided Engineering


The Evolution of RT

Rapid Soft Tooling (RST)

Rapid Bridge Tooling (RBT)

Rapid
p Hard Tooling
g ((RHT))

ENGI 7962 Computer-Aided Engineering


The Evolution of RT

ENGI 7962 Computer-Aided Engineering


Rapid Soft Tooling (RST)
• Tools are made using RP
• Parts are molded using
– Room
R T
Temperature
t Vulcanization
V l i ti (RTV)
– Vacuum Casting
– NOT
O Injection Molded
• NOT fabricated from end use material
• Typically less than 30 parts per mold

ENGI 7962 Computer-Aided Engineering


Rapid Bridge Tooling (RBT)
• Utilizes advanced RP techniques
• Accurate Clear Epoxy Resins (ACES)
• I j ti molded
Injection ld d parts
t
• Use of ACES allows entire project from
CAD design to 100 molded prototypes in 5
days.

ENGI 7962 Computer-Aided Engineering


Rapid Hard Tooling (RHT)
• Fabricate the RP part
• Cover part with flexible silicon rubber
• B k apartt and
Break d sendd tto local
l l ffoundry
d
• Ceramic part replica of RP part
• Aluminum tooling cast from ceramic part
• Parts can be “shot”
shot in real production
material

ENGI 7962 Computer-Aided Engineering


ENGI 7962 Computer-Aided Engineering

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