Huawei LTE Overview PDF
Huawei LTE Overview PDF
Huawei LTE
Overview
www.huawei.com
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 2
Increasingly Global LTE Commitments
Global LTE Commitments
6X increase in
past 18 months
Latin
LatinAmerica:
America: Japan:
Japan:
Major 1.5G/800M/1.7G/2.1G
1.5G/800M/1.7G/2.1Gby
Majorinin2.6G/AWS
2.6G/AWS by
Roaming NTT/KDDI/SBM
Roamingfor forU.S
U.Sand
andEU
EU NTT/KDDI/SBM
Africa:
Africa: Asia
AsiaPacific:
Pacific:
Major
Majorinin2.6G
2.6G
2.6G
2.6G
1.8G Reframing
1.8G Reframing License Issued Auction in 2010 Auction after 2010 TBD
1.8G,
1.8G,2.1G
2.1GRefarming
Refarming
Spectrum License Progress
MENA:
MENA: • 2009: 10 countries, 38 Operators India:
India:
Major
Majorinin2.6G BWA
BWA(TD-LTE)
(TD-LTE)2.3G
• 2010:
2.6G 20+ countries, 50+ operators 2.3G
1.8G Refarming
1.8G Refarming • 2011: 30+ countries, 60+ operators
HUAWEI TECHNOLOGIES
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SEMICONDUCTOR Page 4
LTE Take-up Roadmap: From Data offload to Full
Services
Phase1 Phase2 Phase3 Phase4
(2010/11) (2011/12) (2012/13) (>2013)
Data Only Data Only + CSFB IMS VoIP & SR-VCC Full multimedia
IMS
All-IP
G/U/L network
handsets VoIP PCC &
launch handsets QoS
launch
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 5
Commercially Available LTE Terminals
Chipset
Vendors
Terminal
Vendors
Terminal
USB USB
LTE only Multi-mode: GUL, CL Multiple Commercial Devices: Handset
USB, MID, Netbook, etc.
800M
Spectral Efficiency
CA
CA
850M
UMTS
UMTS Title CoMP FDD
FDD LTE
LTE
900M 300Mbps
/20MHz
1500M 150Mbps
/20MHz Relay
1700M 84Mbps
CDMA
CDMA /10MHz
1800M 4x4 4x4
1900M MIMO
42Mbps 2x2 MIMO
DC
/5MHz MIMO
2100M
TD-SCDMA
TD-SCDMA 28Mbps
2300M /5MHz 2x2
21Mbps MIMO
2x2
OFDM
OFDM OFDM TDD
TDD LTE
LTE
2600M MIMO
/5MHz
2x2
…… WiMAX
WiMAX 64QAM MIMO 64QAM 64QAM 64QAM 64QAM 64QAM
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 8
Persistent Investment on LTE
Worldwide LTE R&D Centers Global LTE Patent Share
Stockholm Moscow
Core algorithm RF technology
ASIC, algorithm
Dallas Beijing
Chengdu
San Diego Shanghai
Terminal,
chipset
1
eNodeB, RF,
eNodeB, SAE,
Source: ETSI
Terminal, ASIC
(Oct. 2010)
补充
图片
Best Contribution to
Research & Development
for LTE
Spain Australia
Austria
Norway Norway , Serbia Sweden Belgium Poland
Germany Malaysia
Singapor
Italy
e
Uzbekistan
Germany Germany Latvia Austria
& Armenia Portugal Philippine
Saudi
(*) 8 commercial contracts are not listed due to NDA with customers. Greece
Arabia
Switzerland Saudi
Arabia
UAE
World’s 1st LTE commercially launched USA
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 11
TeliaSonera, the World’s 1st LTE Commercial
Network
Oslo
Quality Proved
Commercial Capability
DL data rate:
90.6 Mbps
Operator A
2.6GHz cell
Shared eRAN
900MHz cell
Operator B GSM LTE
RAN
RAN sharing:
sharing: MOCN
MOCN Multi-Mode:
Multi-Mode: LTE900
LTE900 &
& GSM900
GSM900 Multi-Band:
Multi-Band: 2.6G
2.6G &
& 900M
900M
HUAWEI TECHNOLOGIES
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SEMICONDUCTOR Page 13
Vodafone D2, the World’s 1st DD800 LTE Commercial
Network
Challenges and Needs
• Commitment to German Government for universal
broadband coverage with DD800M in rural area
• Reducing OPEX (energy, leasing and rental cost, Q&M,
etc.)
• Minimizing Complexity with “One Site, One Vendor”
strategy
• All IP Network for MBB service booming
3M RRU:
LTE 800MHz
LTE 2600MHz
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 14
World’s 1st LTE 1800MHz and LTE TDD Commercial
Network
Challenges and Needs
• New mobile operator in Poland telecom market, finding
differentiated services to compete with existing
operators
• Fast growing data service requirement and saturated
voice service market
• Making best use of 19.8MHz available bandwidth on
1800M
BBU
HUAWEI TECHNOLOGIES
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SEMICONDUCTOR Page 16
Agenda
HUAWEI TECHNOLOGIES
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SEMICONDUCTOR Page 17
Leading LTE Solution
Challenges
HUAWEI TECHNOLOGIES
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SEMICONDUCTOR Page 18
End-to-End LTE Readiness
Terminal Radio Backhaul Core
HUAWEI TECHNOLOGIES
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SEMICONDUCTOR Page 19
End-to-End LTE Solution
Terminal eRAN Backhaul EPC
Distributed
MME
IP Backhaul
or MSTP SGW/PGW
HSS
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 20
LTE Product Portfolio
Common Modules
1 2 3 4
• LTE/HSPA/EDGE multimode
• FE/WIFI 802.11n,b,g
• Commercial: Jun. 2011
• DL 4*2 MIMO
•DL/UL: 50/50Mbps
•DL 2*2 MIMO
LTE TDD 2.0
• DL: 135Mbps, UL: 45Mbps
• DL 4*2 MIMO
• 2.3G, 2.6G
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 22
Performance Enhancement
Improving cell
throughput Capacity
Increasing cell edge +
user data rate
Heterogeneous
architecture
Seamless service
Experienc experience
e Service continuity
+ solution
Coverage
UL/DL coverage enhancement solution
+
Multi-band combination to enlarge LTE coverage
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 23
MIMO, the Key to Improve Cell
Throughput Capacity +
-- System1x2
Gain:
SIMO
2X2 MIMO over SIMO xx.xx%: Gain SIMO
MIMO
eNode
UE 1 Macr
Throughput (Mbps)
B 18.15% 15.12%
o L LL 20
16.4 28.34%
14.23
TTT 15 13.88
EEE 12.09 12.36
10 9.42
5
2x2 MIMO
eNode
UE 1
B ISD:500m ISD:500m ISD:1732m
Speed:3km/h Speed:30km/h Speed:3km/h
xx.xx%: Gain SIMO
46.94% 46.40% MIMO
35.18
34.15
Throughput (Mbps)
30 56.68%
Micro 24.03
26.87
In typical urban
23.24
20
17.15
area:
15%~28% gain over SIMO @ 10
Macro
~50% gain over SIMO @ Micro
Outdoor-to-Indoor Outdoor-to-Outdoor Outdoor-to-Outdoor
Speed: 3km/h Speed: 3km/h Speed: 30km/h
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 24
More Gains through Higher-order MIMO Capacity +
eNodeB UE 1 eNodeB
UE 1
UE 2
4x4 MIMO v.s. 2x2 MIMO: 2x4 MU-MIMO v.s. 1x2 SIMO:
23%~90% increasing in edge user
~ 50% gain
23%~90% in average
increasing in edge cell
user ~50% gain in average cell
throughput
throughput
throughput throughput
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 25
Mobility Velocity (km/h) Adaptive MIMO Increasing Cell Throughput Capacity +
HUAWEI TECHNOLOGIES
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SEMICONDUCTOR Page 26
Increasing Cell Edge User Data Rate with IRC and
ICIC Capacity +
Noise Different subband allocated for different cell edge users among cells
antenna 2 Evaluate
d
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 27
Heterogeneous Architecture to Improve System
Capacity Capacity +
• Inter-RAT Mobility
Control Macro / DBS for macro-cell coverage
GGGL L L
/ / / TTT
GSM / UMTS Layer UUUEEE
One network
one deployment
one maintenance
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 28
Coverage Enhancement Solution Coverage +
40%
40%
3~5dB
3~5dB Coverage
Coverage
gain
gain Increased TTI bundling, 30% coverage enhancement
Increased
coverage enhancement solutions TTI bundling can be introduced:
IRC - 3dB gain Limited by uplink coverage
TTI bundling - 4dB
Uplink
After Bundling
4*2/4*4 MIMO - 3dB gain
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 29
Multi-band Deployment to Enlarge LTE
Coverage +
Coverage
Multi-band LTE Deployment Strategy
L-2600 (20
Coverage Gain with Low Frequency MHz)
Urba Wide Coverage Distance 2600 MHz: LTE coverage in hotzones / cities
n 1800 MHz: migrate from GSM to LTE, covering
Scenario
Core algorithms guarantee performance:
AFC (Auto Frequency
In shanghai
HQ Correction) algorithm to eliminate
Doppler effect
High speed scheduling
algorithm to reduce the inter-cell
Shanghai Meglev Train 8 eNodeBs, 11 cells, 20km
interference
Excellent Performance in high-speed coverage:
RRU Co-cell to largely reduce
hand over
High speed: up to 431 Km/H
Handover success rate: >99.5%
Handover interruption latency.
100ms
Average DL rate for single UE:
Cell coverage Data Rate for Single UE @ 120 Km/H >20Mbps◎120Km/H
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 31
Service Continuity with Inter-RAT Interworking
Solution Experience+
CS connectivity PS connectivity
Heavy Heavy
LTE LTE Load Load
Cell Reselection
CS Fall back (CSFB) PS Handover
SRVCC
Heavy Heavy
GSM/UMTS
GSM/UMTS Load Load
Service-based
Service-based
Handover
Handover
Load-based
Load-based Load-based
Load-based
Handover
Handover Handover
Handover
Coverage-based
Coverage-based Coverage-based
Coverage-based Coverage-based
Coverage-based
Handover
Handover Handover
Handover Handover
Handover
Internet Internet
VoIP
Internet
Voice
IMS
PS HO SRVCC
SRVCC
Legend: VoIP PS Data CS Voice
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 33
Cost-Effectiveness Solution
Green
1 Site Solution 2 Green eNodeB
Ultra coverage solution Site Cost Dynamic Tx ON/OFF
Saving Power
Flexible site solution Dual-band Intelligent
Savin
Shutdown
g
TCO Dynamic PA Voltage
Adjustment
Saving
Networ
4 LTE RAN Sharing k Operatio 3 SON
Dedicated Carrier RAN Sharing n More Automatic Planning
Sharing Efficiency Self-Configuration
Common Carrier RAN Self-Optimization
Sharing Self-Maintenance
1800/2100MHz
2.6GHz
RRU
RRU
+
2.6GHz
GGGU UU 2100MHz
1800MHz LLLL LL
LLL
GGG
TTT 900MHz
800MHz E E EUUU
Close to antenna
Centralized
3MRRU installation
8XMacro: BTS3900L
• Multi-band/Multi-
• 5 Bands, 3 Modes @ 1 cabinet
mode/MIMO
• No combiner, no insert loss
• Smallest RRU: <15 kg
HUAWEI TECHNOLOGIES
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SEMICONDUCTOR Page 35
Power Consumption Saving by Green eNodeB
Dynamic Tx Configuration Dual-band Intelligent
Power off
Shutdown
F2: hot
PA2 PA2 during • Power on
off F2 during low load spot
low load when load
PA1 increasing
F1: seamless
>15% power consumption saving >20% power saving at coverage
hot
spot
eNodeB Power Consumption:
Dynamic PA Voltage
Adjustment• Dynamically adjust PA >10% Y-o-Y
Power Consumption
voltage according to 16% reduction
11%
output power,
modulation mode, etc.
• 5% PA Efficiency
Improvement
2009 2010 2011
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 36
SON Improving Operation Efficiency
MISS LTE SON Trial in T-Mobile Austria
•Minimize Configuration
•Improve Network KPI
•Shorten Expertise Education
•Simplify Network management
ON
Automatic PCI/TA Optimization
Automatic Network Planning Total
Automatic Config. Planning Automatic Neighbor Relation Test Handover
Inter-RAT ANR,MRO, System Load automatic
Automatic Parameter Planning scenari success
Balance, RACH Optimization added
o rate
neighbors
Inventory Management
Self- configuration (Plug & Play) Sleeping Cell detection Round
Auto Software Management Antenna Fault Detection 91% 74
Cell/interface/sub. trace 1
Round
97% 94
2
SON makes LTE network more efficient and solves new challenges when network architecture
changes
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 37
Typical SON Features at Initial Stage
ANR: Automatic Neighbor Self-Config.: Quick
Relation Deployment
S/W File Server
Config
Config
Config EMS + DHCP
Config
New S/W
eNodeB
Value
unnecessary HO Rate
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 38
40% Saving with RAN Sharing Solution
Sweden MOCN Poland eRAN Sharing
f1
Tele2 Mobyland
Carrier Shared F1/F2
f1/F2
f2 F1/F2
Telenor Centern
et
Independent Service Deployment
Aggregated Spectrum for High Bandwidth
Independent PM/FM/CM (cell level)
Site reduction for rural coverage
Shared FM/CM, partly Independent PM Independent expansion
Shared optimization and expansion Shared optimization
UE compliant to 3GPP R8 No requirement for UE
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 40
SDR Facilitating Smooth Evolution
Spectrum for LTE Smooth Transition to LTE
LTE
GSM+UMTS
2600MHz
SDR SDR
UMTS LTE
2100MHz LTE
GSM
GSM mRRU MRFU
1800MHz LTE
GSM
900MHz UMTS LTE
Technolo 800M 900M 1800M 2100M 2.6G Spectrum refarming starts from
gy 900M/1800M, which can be utilized for LTE
GSM deployment.
UMTS SDR technology supports flexible and
smooth transition from 2G/3G to LTE.
LTE
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 41
GL Refarming Solution
-- Supporting Smooth Evolution from GSM to LTE
GSM
GSM GSM+LTE
GSM+LTE LTE
LTE
Software Software
MRRU LTE
• upgrade upgrade LTE LTE MIMO
GSM
900M/1800 GSM
M
• 2*2 MIMO
G G G
Software L L L Software L
T
L
T
L
T
MRFU
S S S
LTE
M M M
upgrade G G G upgrade LTE
E E E
• GSM
GSM
900M/1800
M LTE
• 2*2 MIMO MIMO
Add
Software
LTE Board
F
Power F
Upgrade
A Power F
GTMU A Power
Multi-mode N Power N LBBP
GTMU
LMPT Power
A
N
LBBP LMPT Power
BBU GSM Board
LTE
LTE Board Board