TSMC OIP 2012

ARM® big.LITTLE™ MP Processing
Check out a demonstration of a big.LITTLE system working in MP mode, with all cores on both clusters sharing the total workload across the system. Tasks are allocated to each core depending upon their processing requirement, ensuring appropriate loading on each cluster.

ARM® Mali™ GPUs – Console Quality Gaming with Advanced Visuals
The ARM Mali family of Graphics Processing Units (GPUs) scales to deliver industry-leading graphics on entry-level smartphones, right through to visually stunning user experiences for the future of top-end, cutting-edge superphones, tablets and smart TVs. This demo features devices powered by ARM® Mali™-400 MP GPUs and dual-core ARM Cortex™-A9 processors.

ARM POP™ IP Technology
Targeting 40nm, 28nm and 20nm process, ARM POP IP is comprised of core-hardening acceleration technology which incorporates the latest ARM Artisan® advanced physical IP to achieve industry-leading power, performance and area (PPA) metrics. Find out more about how POP IP can help designers achieve implementation of ARM processors and GPUs in the shortest time-to-market.

FinFET Physical IP
ARM and TSMC are collaborating to optimize next-generation 64-bit ARM processors for FinFET process technology at 16nm. Learn more about FinFET, the next wave of transistor technology.

ARM Keynote:
Title: Advanced Technology and the Ecosystem: The Road to FinFET
Speaker: Simon Segars - EVP and General Manager, Processor and Physical IP Divisions
When: 10/16/2011, 10:00 am - 10:30 am
Where: General Session Hall 1

Abstract: The fabless industry has fueled unprecedented growth in the semiconductor industry for more than two decades. The collaborative development between the foundry and IP ecosystems is a key ingredient in the ability of semiconductor companies to differentiate their products in the marketplace. As advanced technology moves toward the much-anticipated FinFET transistors, foundry, IP and EDA partners must take their collaboration to a new level to enable fabless companies to leverage the most advanced technologies to deliver innovative products.

At the forefront of this trend, ARM and TSMC are working together to optimize the processor and the process to provide SoC power efficiency and faster time-to-market. The openness of the ARM® Connected Community® and TSMC Open Innovation Platform (OIP) are key to delivering efficiency and effectiveness across the ecosystem that will provide a foundation for the continued success of the fabless industry.