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News
Nufront Announces Taishan Platform Targeting Mobile Devices Market
datetime£º2012-5-8
Beijing, China–May 7, 2012 – Nufront, one of the leading fabless companies in China, today announced the availability of Nufront’s Taishan platform, which bundles Nufront’s latest WCDMA/GSM baseband chip Telink7619 and its mobile computing chip NS115. With this new platform, Nufront can provide one of the most innovative total solutions for both baseband and application processors, targeting mobile devices, such as smartphones and tablets, as well as smart TV and cloud computing devices.
“The launch of the Taishan platform is another milestone of Nufront through our partnership with ARM,” said Yu Wei, General Manager, Nufront. “This partnership enables Nufront to fully leverage the latest ARM technologies for designing solutions especially adapted to mobile computing and low power communications environment. We look forward to continuing working closely with ARM to provide our customers with a consistent roadmap and products that deliver the best user experience.”
The Telink7619 WCDMA/GSM baseband chip is based on a dual-core ARM9™ processor with super low power design. It supports DigRF, GMS/GPRS/EDGE/WCDMA/HSDPA 14.4 Mbps/HSUPA 5.76 Mbps. The NS115 mobile computing chip, a dual-core ARM Cortex™-A9 MPCore™ processor up to 1.5GHz and Mali™-400 MP GPU implementation, features 1080P HD encode/decode and support of Android 4.0. Based on the most advanced ARM architecture and technologies, including an ARM Cortex-A9 Processor Optimization Pack™ (POP), the NS115 mobile computing chip can support DVFS, multi-Vt and Multi-Vd while also achieving the best-in-class power efficiency. NS115 is Nufront’s third generation dual-core Cortex-A9 chip, achieving the best cost and power efficiency so far. With the POP packaging, NS115 will support both Smartphone and Tablet.
In 2010, with the launch of NS 2816, a dual-core Cortex-A9 MPCore implementation up to 2GHz, Nufront became the first Chinese company to deliver ARM-based chip design and manufacturing at 40nm process node.
“Today’s consumers increasingly expect a lifestyle of having their world at their fingertips. Working closely with partners like Nufront, ARM and its ecosystem are innovating to meet this demand,” said Lance Howarth, EVP of marketing, ARM. “The combination of ARM’s microprocessor, GPU and physical IP with Nufront’s expertise in system-on-chip design enables a highly integrated, cost and power efficient platform that meets consumers’ demanding expectations for next-generation connected mobile devices and will enable Nufront to address multiple opportunities across the connected device landscape. ”
Availability
Samples of the Nufront Taishan platform (Telink7619 and NS115) is available now.
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